JPS6410697A - Method and apparatus for forming through hole in substrate - Google Patents

Method and apparatus for forming through hole in substrate

Info

Publication number
JPS6410697A
JPS6410697A JP16654187A JP16654187A JPS6410697A JP S6410697 A JPS6410697 A JP S6410697A JP 16654187 A JP16654187 A JP 16654187A JP 16654187 A JP16654187 A JP 16654187A JP S6410697 A JPS6410697 A JP S6410697A
Authority
JP
Japan
Prior art keywords
paint
holes
hole
thick
film circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16654187A
Other languages
Japanese (ja)
Other versions
JPH0463559B2 (en
Inventor
Osamu Itagaki
Katsuhiko Taguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Juki Corp
Original Assignee
Juki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Juki Corp filed Critical Juki Corp
Priority to JP16654187A priority Critical patent/JPS6410697A/en
Publication of JPS6410697A publication Critical patent/JPS6410697A/en
Publication of JPH0463559B2 publication Critical patent/JPH0463559B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To provide a through hole in a stable manner, by distributing a paint for thick-film circuit onto holes in a ceramic substrate disposed on a table mechanism and ejecting compressed air from the above toward the paint for causing the paint to adhere to the peripheral walls of the holes. CONSTITUTION:A ceramic substrate 6 disposed on a table 5 is provided with holes 6a, into which a predetermined amount of paint 7 for thick-film circuit is distributed from a nozzle 2. Since the thick-film circuit paint 7 thus distributed does not enter directly the hole 6a, air is ejected by an air ejecting nozzle 12 from the above toward the hole 6a so that the paint 7 is adhered on the peripheral wall of the hole 6a while excessive paint 7 is blown off from the central region by the air jet. In this manner, the holes 6a become through holes having the thick-film circuit paint 7 on the peripheral wall thereof. Therefore, it is easy to provide through holes by the use of the holes 6a in the ceramic substrate 6 and hence the working efficiency can be improved.
JP16654187A 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate Granted JPS6410697A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16654187A JPS6410697A (en) 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16654187A JPS6410697A (en) 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate

Publications (2)

Publication Number Publication Date
JPS6410697A true JPS6410697A (en) 1989-01-13
JPH0463559B2 JPH0463559B2 (en) 1992-10-12

Family

ID=15833191

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16654187A Granted JPS6410697A (en) 1987-07-03 1987-07-03 Method and apparatus for forming through hole in substrate

Country Status (1)

Country Link
JP (1) JPS6410697A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034591A (en) * 1989-06-01 1991-01-10 Juki Corp Manufacture of thick film circuit
JPH07221445A (en) * 1994-01-27 1995-08-18 Sakae Denshi Kogyo Kk Method and device to obtain continuity of through hole
EP0711106A1 (en) * 1994-11-02 1996-05-08 Lpkf Cad/Cam Systeme Gmbh Process for making through-hole connections in multilayer printed circuit boards

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119791A (en) * 1982-12-25 1984-07-11 富士通株式会社 Method of forming conductor layer of through hole
JPS59151493A (en) * 1983-02-17 1984-08-29 日本電気アイシ−マイコンシステム株式会社 Method of forming through hole

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59119791A (en) * 1982-12-25 1984-07-11 富士通株式会社 Method of forming conductor layer of through hole
JPS59151493A (en) * 1983-02-17 1984-08-29 日本電気アイシ−マイコンシステム株式会社 Method of forming through hole

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH034591A (en) * 1989-06-01 1991-01-10 Juki Corp Manufacture of thick film circuit
JPH07221445A (en) * 1994-01-27 1995-08-18 Sakae Denshi Kogyo Kk Method and device to obtain continuity of through hole
EP0711106A1 (en) * 1994-11-02 1996-05-08 Lpkf Cad/Cam Systeme Gmbh Process for making through-hole connections in multilayer printed circuit boards

Also Published As

Publication number Publication date
JPH0463559B2 (en) 1992-10-12

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