JPS641076B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an electrical connection device in which terminals of two substrates are electrically connected by a connector in which thin metal wires are embedded in a silicone rubber sheet.

The configuration of the above connector is shown in FIG. In the figure, a is a cross-sectional view, and b is a plan view. In the figure, 1 is a thin metal wire (gold plated) and 2 is a silicone rubber sheet. This connector is as shown in the figure.
Both ends of the thin metal wire 1 slightly protrude from the sheet surface. Its features are: (1) It can connect between terminals with a gap, such as between a liquid crystal display and a circuit board. (2) Contact resistance is low, on the order of several ohms. In addition, the mounting method is different from general rubber connectors because the thin metal wires 1 protrude from the sheet surface, so even if adhesive or adhesive is applied to the terminals of the board and fixed from above, The thin metal wire 1 penetrates through the adhesive layer and comes into contact with the terminal surface to establish electrical continuity.

On the other hand, Cr-Au, Cr-Cu, Cr-Ni on glass
Alternatively, a substrate having a thin film formed by vapor-depositing indium oxide or the like has the feature that fine patterning of electrodes and bonding of LSI chips are possible.
As a result, a structure in which a thin film is formed on a liquid crystal display and chips and other parts are mounted on it has been put into practical use. In this case, it is necessary to reduce the resistance value between the LSI and the power supply and components not mounted on the thin film, so in the conventional technology, the flexible substrate and the thin film are soldered. Figure 2 shows its configuration. In the figure, 3 is a Cr-Au thin film, 4 is an LSI chip, 5 is a flexible board, and 6 is a connection part (soldering). The disadvantage of soldering was that it was not possible to use a rigid board, so an expensive flexible board had to be used.

The present invention has been made in view of the above points, and is intended to electrically connect a thin film board and a rigid circuit board using the aforementioned connector. Due to the features of this connector, there is no problem in terms of contact resistance, but if it is simply sandwiched between both boards, the positive electrode (terminal) will react with moisture in the air and oxidize due to electrolytic corrosion when the current is on, causing the electrical There may be a lack of communication. When two layers of Cr-Au are deposited,
The underlying Cr melts away due to electrolytic corrosion,
If the reaction progresses, the pattern may break. As a means to prevent electrolytic corrosion, there is a method of applying silicone resin on the terminals. In the present invention, a silicone resin is applied onto a terminal, and the silicone resin is coated with a silicone resin.
It serves as a moisture-proof material to prevent electrical corrosion and leakage of terminals, and also serves as an adhesive for fixing the connector onto the thin film substrate.

FIG. 3 is a sectional view showing the configuration of an embodiment of the present invention.

The procedure is as follows.

(1) Apply silicone resin 11 on the Cr-Au thin film terminal 12 (13 is glass).

(2) Place the connector 14 (9: fine metal wire, 10: silicone rubber sheet) on top of it.

(3) Furthermore, the rigid circuit board 7 is aligned and placed on top of it (8 is its terminal) and fixed with a holding plate or the like.

(4) Dry the resin 11.

Note that there is also a method of drying the resin 11 by pressing the connector 14 at the time of (2) above, and then placing the board 7 thereon. In this case, when assembling the board 7, the connector 1
4 is fixed, allowing for smooth work.

Since the terminals 8 and 12 on both boards are connected by the thin metal wire 9 of the connector 14, the resistance value is small. Further, since the terminals 12 made of the Cr-Au thin film are all covered with the resin 11 serving as a moisture-proofing material, electrolytic corrosion can be prevented.

As explained in detail above, according to the present invention, it is possible to electrically connect a thin film substrate and a rigid circuit board without causing electrolytic corrosion, leakage, etc. and with a low contact resistance value. When using a thin film substrate, it is possible to use an inexpensive hard substrate in place of a conventional flexible substrate. INDUSTRIAL APPLICATION This invention can be utilized for the connection between the liquid crystal display board, printed wiring board, etc. in a calculator, a watch, etc.

[Brief explanation of drawings]

FIG. 1a is a sectional view, FIG. 1b is a plan view, FIG. 2 is a perspective view, and FIG. 3 is a sectional view. Code, 1: Metal thin wire, 2: Silicon rubber sheet, 7: Hard circuit board, 8: Terminal, 9: Metal thin wire, 10: Silicon rubber sheet, 11: Silicone resin, 12: Cr-Au thin film terminal, 13 : Glass, 14: Connector.

Claims (1)

[Claims] 1. In a device that electrically connects the terminals of two boards using a connector with a thin metal wire embedded in a silicone rubber sheet, prevent electrical corrosion of the terminal between the terminal and the connector. An electrical connection device characterized by having a structure in which a layer of silicone resin is provided, which serves as a moisture-proof material and a fixing material for the connector.