JPS6411362A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS6411362A JPS6411362A JP62167627A JP16762787A JPS6411362A JP S6411362 A JPS6411362 A JP S6411362A JP 62167627 A JP62167627 A JP 62167627A JP 16762787 A JP16762787 A JP 16762787A JP S6411362 A JPS6411362 A JP S6411362A
- Authority
- JP
- Japan
- Prior art keywords
- film
- semiinsulating
- additional capacitance
- polycrystalline silicon
- capacitance part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 abstract 5
- 239000003990 capacitor Substances 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 229920005591 polysilicon Polymers 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B10/00—Static random access memory [SRAM] devices
Landscapes
- Semiconductor Integrated Circuits (AREA)
- Semiconductor Memories (AREA)
Abstract
PURPOSE:To reduce an area to be occupied by a memory cell and to realize the high integration density of the memory cell by a method wherein a dielectric film constituting an additional capacitance part and a high-value resistor are composed of an identical semiinsulating film so that the additional capacitance part and the high-value resistor can be installed in an identical place. CONSTITUTION:A semiinsulating film 8 such as, e.g., a semiinsulating polysilicon (SIPOS) film is formed on the surface of a polycrystalline silicon film 7; e.g., a polycrystalline silicon film 9 of a third layer is formed on the semiinsulating film 6. This polycrystalline silicon film 9 is set at a power supply level Vcc. An additional capacitance part C is constituted by a stacked capacitor by making use of these polycrystalline silicon films 7, 9 as electrodes and by making use of the semiinsulating film 8 as a dielectric film. In this case, the semiinsulating film 8 is used as a high value resistance part R. That is to say, the dielectric film constituting the additional capacitance part C and the high- value resistance part R are composed of the identical semiinsulating film 8. By this setup, the additional capacitance part C and the high-value resistance part R can be formed in an identical place.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62167627A JPS6411362A (en) | 1987-07-03 | 1987-07-03 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62167627A JPS6411362A (en) | 1987-07-03 | 1987-07-03 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6411362A true JPS6411362A (en) | 1989-01-13 |
Family
ID=15853293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62167627A Pending JPS6411362A (en) | 1987-07-03 | 1987-07-03 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6411362A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0430391A (en) * | 1990-05-28 | 1992-02-03 | Toshiba Corp | Static type semiconductor memory |
| KR19990025316A (en) * | 1997-09-11 | 1999-04-06 | 윤종용 | Capacitor Formation Method on Substrate |
| JP2009281347A (en) * | 2008-05-26 | 2009-12-03 | Denso Corp | Fuel injection device |
-
1987
- 1987-07-03 JP JP62167627A patent/JPS6411362A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0430391A (en) * | 1990-05-28 | 1992-02-03 | Toshiba Corp | Static type semiconductor memory |
| KR19990025316A (en) * | 1997-09-11 | 1999-04-06 | 윤종용 | Capacitor Formation Method on Substrate |
| JP2009281347A (en) * | 2008-05-26 | 2009-12-03 | Denso Corp | Fuel injection device |
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