JPS641261A - Electronic device - Google Patents

Electronic device

Info

Publication number
JPS641261A
JPS641261A JP62155460A JP15546087A JPS641261A JP S641261 A JPS641261 A JP S641261A JP 62155460 A JP62155460 A JP 62155460A JP 15546087 A JP15546087 A JP 15546087A JP S641261 A JPS641261 A JP S641261A
Authority
JP
Japan
Prior art keywords
hole
plate
header
heat sink
mounting hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62155460A
Other languages
English (en)
Other versions
JPH011261A (ja
Inventor
Akira Masuda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62155460A priority Critical patent/JPS641261A/ja
Publication of JPH011261A publication Critical patent/JPH011261A/ja
Publication of JPS641261A publication Critical patent/JPS641261A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP62155460A 1987-06-24 1987-06-24 Electronic device Pending JPS641261A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62155460A JPS641261A (en) 1987-06-24 1987-06-24 Electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62155460A JPS641261A (en) 1987-06-24 1987-06-24 Electronic device

Publications (2)

Publication Number Publication Date
JPH011261A JPH011261A (ja) 1989-01-05
JPS641261A true JPS641261A (en) 1989-01-05

Family

ID=15606533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62155460A Pending JPS641261A (en) 1987-06-24 1987-06-24 Electronic device

Country Status (1)

Country Link
JP (1) JPS641261A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0531246U (ja) * 1991-09-30 1993-04-23 関西日本電気株式会社 半導体装置
US7106593B2 (en) 2004-04-06 2006-09-12 Motor Components, Llc Heat sink assembly for a potted housing
US12489031B2 (en) 2021-12-09 2025-12-02 Fuji Electric Co., Ltd. Semiconductor device and manufacturing method thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0531246U (ja) * 1991-09-30 1993-04-23 関西日本電気株式会社 半導体装置
US7106593B2 (en) 2004-04-06 2006-09-12 Motor Components, Llc Heat sink assembly for a potted housing
US12489031B2 (en) 2021-12-09 2025-12-02 Fuji Electric Co., Ltd. Semiconductor device and manufacturing method thereof

Similar Documents

Publication Publication Date Title
ES290989U (es) Conexion electrica atornillada
JPS641261A (en) Electronic device
CA2289145A1 (en) Ready to wire terminal assembly with vibration resistant clamping screws
JPS6442135A (en) Semiconductor device
JPS55103753A (en) Electronic component
KR940004134Y1 (ko) 자동 솔더링(soldering)용 방열판 고정장치
JP2003166787A (ja) 加熱炉用ヒータ端子装置
JPS6459895A (en) Electronic part mounting device
JPS5578557A (en) Semiconductor device
JPS5651847A (en) Preparation of semiconductor device
JPS6025905Y2 (ja) 半導体素子の支持板
JPS6418267A (en) Semiconductor device
JPS55127043A (en) Semiconductor device
JPS57143850A (en) Fitting of semiconductor element to circuit board
JPH07297569A (ja) ケーブルクランプ
JPS54128279A (en) Heat sink for resin-sealed semiconductor device and its manufacture
JPS5230382A (en) Semiconductor package device
JPS5419661A (en) Electronic component device
KR910007316Y1 (ko) 발열반도체 부품의 방열판 고정장치
JPS53124072A (en) Semiconductor device
JPS5468166A (en) Isolation type semiconductor device
CA2018808A1 (en) Power semiconductor package
JPS5232683A (en) Manufacturing process of semiconductor device
JPS51111058A (en) Electrode forming method for semiconductor device
JPS5214167A (en) Tapping thread