JPS641264A - Cooler for integrated circuit element - Google Patents

Cooler for integrated circuit element

Info

Publication number
JPS641264A
JPS641264A JP62157197A JP15719787A JPS641264A JP S641264 A JPS641264 A JP S641264A JP 62157197 A JP62157197 A JP 62157197A JP 15719787 A JP15719787 A JP 15719787A JP S641264 A JPS641264 A JP S641264A
Authority
JP
Japan
Prior art keywords
refrigerant
integrated circuit
circuit element
sealing
passage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62157197A
Other languages
English (en)
Other versions
JPH011264A (ja
JPH07112035B2 (ja
Inventor
Haruhiko Yamamoto
Masahiro Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP62157197A priority Critical patent/JPH07112035B2/ja
Publication of JPS641264A publication Critical patent/JPS641264A/ja
Publication of JPH011264A publication Critical patent/JPH011264A/ja
Publication of JPH07112035B2 publication Critical patent/JPH07112035B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP62157197A 1987-06-23 1987-06-23 集積回路素子の冷却装置 Expired - Fee Related JPH07112035B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62157197A JPH07112035B2 (ja) 1987-06-23 1987-06-23 集積回路素子の冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62157197A JPH07112035B2 (ja) 1987-06-23 1987-06-23 集積回路素子の冷却装置

Publications (3)

Publication Number Publication Date
JPS641264A true JPS641264A (en) 1989-01-05
JPH011264A JPH011264A (ja) 1989-01-05
JPH07112035B2 JPH07112035B2 (ja) 1995-11-29

Family

ID=15644326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62157197A Expired - Fee Related JPH07112035B2 (ja) 1987-06-23 1987-06-23 集積回路素子の冷却装置

Country Status (1)

Country Link
JP (1) JPH07112035B2 (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244398A (ja) * 2007-03-29 2008-10-09 Nissan Motor Co Ltd 冷却装置
EP2151863A1 (en) 2008-07-31 2010-02-10 Lucent Technologies Inc. A jet impingement cooling system
JP2011138840A (ja) * 2009-12-26 2011-07-14 Kyocera Corp 発光素子載置用構造体、発光素子冷却機構、および発光装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008244398A (ja) * 2007-03-29 2008-10-09 Nissan Motor Co Ltd 冷却装置
EP2151863A1 (en) 2008-07-31 2010-02-10 Lucent Technologies Inc. A jet impingement cooling system
JP2011138840A (ja) * 2009-12-26 2011-07-14 Kyocera Corp 発光素子載置用構造体、発光素子冷却機構、および発光装置

Also Published As

Publication number Publication date
JPH07112035B2 (ja) 1995-11-29

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees