JPS641265A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS641265A
JPS641265A JP62155451A JP15545187A JPS641265A JP S641265 A JPS641265 A JP S641265A JP 62155451 A JP62155451 A JP 62155451A JP 15545187 A JP15545187 A JP 15545187A JP S641265 A JPS641265 A JP S641265A
Authority
JP
Japan
Prior art keywords
burrs
feeder
frame
lead
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62155451A
Other languages
Japanese (ja)
Other versions
JPH011265A (en
Inventor
Shigeru Arai
Susumu Iizaka
Miharu Nakajima
Junichi Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62155451A priority Critical patent/JPS641265A/en
Publication of JPH011265A publication Critical patent/JPH011265A/en
Publication of JPS641265A publication Critical patent/JPS641265A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07521—Aligning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To improve productivity and solderability in a lead frame supported in cooperation of leads with an outer frame by so forming burrs formed by pressing at a lead group region as to be directed toward opposite side to a land contact face of the lead. CONSTITUTION:When a multi-lead frame 1 is so arranged that the main face of a film 10 is directed upward, burrs 11 of outer frames 3, 3 are directed upward, and burrs 11 of a lead group region A are directed downward. Since a recess 15 is so submerged at the center of a feeder 14, i.e., at a region opposite to the region A as to escape the burrs 11 protruded downward, the frame 1 is slidably contacted with the surface of the feeder 14 at the frames 3, 3 at both ends. Since the burrs 11 of the frame 3 are directed upward, the burrs 11 are not engaged with the surface of the feeder 14. Accordingly, an accident of improperly bending the leads or stopping a conveyance of a feeder can be avoided in advance.
JP62155451A 1987-06-24 1987-06-24 Lead frame Pending JPS641265A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62155451A JPS641265A (en) 1987-06-24 1987-06-24 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62155451A JPS641265A (en) 1987-06-24 1987-06-24 Lead frame

Publications (2)

Publication Number Publication Date
JPH011265A JPH011265A (en) 1989-01-05
JPS641265A true JPS641265A (en) 1989-01-05

Family

ID=15606331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62155451A Pending JPS641265A (en) 1987-06-24 1987-06-24 Lead frame

Country Status (1)

Country Link
JP (1) JPS641265A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049245A (en) * 2009-08-25 2011-03-10 Toyoda Gosei Co Ltd Side-view type light emitting device and method for manufacturing the same
JP2016187026A (en) * 2015-03-27 2016-10-27 ルネサスエレクトロニクス株式会社 Semiconductor device manufacturing method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011049245A (en) * 2009-08-25 2011-03-10 Toyoda Gosei Co Ltd Side-view type light emitting device and method for manufacturing the same
JP2016187026A (en) * 2015-03-27 2016-10-27 ルネサスエレクトロニクス株式会社 Semiconductor device manufacturing method

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