JPS641268A - Ceramic circuit substrate - Google Patents

Ceramic circuit substrate

Info

Publication number
JPS641268A
JPS641268A JP15619787A JP15619787A JPS641268A JP S641268 A JPS641268 A JP S641268A JP 15619787 A JP15619787 A JP 15619787A JP 15619787 A JP15619787 A JP 15619787A JP S641268 A JPS641268 A JP S641268A
Authority
JP
Japan
Prior art keywords
layer
brazing material
metal
brazing
ceramics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15619787A
Other languages
Japanese (ja)
Other versions
JP2589492B2 (en
JPH011268A (en
Inventor
Shinsuke Yano
Hiroshi Kawabe
Takami Hirai
Toshio Nonomura
Susumu Nishigaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Narumi China Corp
Original Assignee
Narumi China Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Narumi China Corp filed Critical Narumi China Corp
Priority to JP62156197A priority Critical patent/JP2589492B2/en
Publication of JPH011268A publication Critical patent/JPH011268A/en
Publication of JPS641268A publication Critical patent/JPS641268A/en
Application granted granted Critical
Publication of JP2589492B2 publication Critical patent/JP2589492B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To connect pins or leads for an I/O terminal to a metal pad by Ag-Cu brazing material by forming the pad to be brazed in a thin film made of heat resistant metal, and associating metal having excellent bondability to ceramics or excellent wettability to the Ag-Cu brazing material.
CONSTITUTION: An Ag conductor 15 is contained in a ceramic substrate 1, and an Si chip 7, and Au electrodes 6 are placed on the upper face. The conductor 15 contained therein and through hole 16 is connected to kover pins 5 as I/O terminal by a thin Ti-Mo-Cu film 3 and further Ag-Cu brazing material 4 on the lower face. The thin film 3 is selected from group 4A, 5A, 6A, 8, 1B element metals of The Periodic Table and combination thereof as a metal layer. That is, a Ti layer 9 is to obtain adherence to the ceramics 1, an Mo layer 10 is to prevent the layer 9 from diffusing in Cn-Ag 3 brazing material, and a Cn layer 11 is to obtain wettability to the Ag-Cu brazing layer 4. Thus, brazing pin and leads having strong bonding strength can be inexpensively obtained.
COPYRIGHT: (C)1989,JPO&Japio
JP62156197A 1987-06-23 1987-06-23 Ceramic circuit board Expired - Lifetime JP2589492B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62156197A JP2589492B2 (en) 1987-06-23 1987-06-23 Ceramic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62156197A JP2589492B2 (en) 1987-06-23 1987-06-23 Ceramic circuit board

Publications (3)

Publication Number Publication Date
JPH011268A JPH011268A (en) 1989-01-05
JPS641268A true JPS641268A (en) 1989-01-05
JP2589492B2 JP2589492B2 (en) 1997-03-12

Family

ID=15622488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62156197A Expired - Lifetime JP2589492B2 (en) 1987-06-23 1987-06-23 Ceramic circuit board

Country Status (1)

Country Link
JP (1) JP2589492B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5003131A (en) * 1988-09-14 1991-03-26 Nkg Spark Plug Co., Ltd. Connection structure between ceramic body and outer terminal
US5521438A (en) * 1993-09-24 1996-05-28 Ngk Spark Plug Co., Ltd. Ceramic base and metallic member assembly
JP2006173222A (en) * 2004-12-14 2006-06-29 Ngk Spark Plug Co Ltd Wiring board

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6083356A (en) * 1983-10-14 1985-05-11 Hitachi Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6083356A (en) * 1983-10-14 1985-05-11 Hitachi Ltd Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5003131A (en) * 1988-09-14 1991-03-26 Nkg Spark Plug Co., Ltd. Connection structure between ceramic body and outer terminal
US5521438A (en) * 1993-09-24 1996-05-28 Ngk Spark Plug Co., Ltd. Ceramic base and metallic member assembly
JP2006173222A (en) * 2004-12-14 2006-06-29 Ngk Spark Plug Co Ltd Wiring board

Also Published As

Publication number Publication date
JP2589492B2 (en) 1997-03-12

Similar Documents

Publication Publication Date Title
KR910004923B1 (en) Ceramic-metal composite substrate, circuit board comprising the same, and manufacturing method thereof
EP1020914A3 (en) Ceramic substrate used for fabricating electric or electronic circuit
EP0935286A4 (en) COPPER CIRCUIT JUNCTION SUBSTRATE AND PROCESS FOR PRODUCING THE SAME
MY124950A (en) Surface electrode structure on ceramic multi-layer substrate and process for producing the same
JPS6473750A (en) Semiconductor device
KR890015462A (en) Ceramic-Metal Composite Substrates, Circuit Boards Composed of It, and Manufacturing Method Thereof
JPH06125026A (en) Terminal structure and input / output terminal member and wiring board using the same
JP2572823B2 (en) Ceramic joint
JP2527828B2 (en) Semiconductor package
JP4467659B2 (en) Ceramic circuit board
JPS54124678A (en) Lead frame
JPH0957487A (en) Brazing material
EP0380289A3 (en) A process of manufacturing a multi-layer ceramic substrate assembly
JPS6454798A (en) Manufacture of ceramic substrate
JP3161815B2 (en) Brazing material for joining ceramics and metal and joining method therefor
JP2002043478A (en) Ceramic circuit board
JPH02174145A (en) Aluminum nitride structure and its manufacture
JPS6261549B2 (en)
KR940005200A (en) Wiring surface treatment method on wiring board
JPH0736429B2 (en) Method for manufacturing ceramic wiring board
JPH04331781A (en) Ceramics composite material
JPS6468935A (en) Face-down bonding of semiconductor integrated circuit device
JPS575341A (en) Semiconductor device
JPS6469022A (en) Wireless bonding structure of chip-shaped electronic part
JPS5961054A (en) Semiconductor device

Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term
FPAY Renewal fee payment (prs date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071205

Year of fee payment: 11