JPS6413751A - Semiconductor circuit unit for power supply - Google Patents
Semiconductor circuit unit for power supplyInfo
- Publication number
- JPS6413751A JPS6413751A JP16998687A JP16998687A JPS6413751A JP S6413751 A JPS6413751 A JP S6413751A JP 16998687 A JP16998687 A JP 16998687A JP 16998687 A JP16998687 A JP 16998687A JP S6413751 A JPS6413751 A JP S6413751A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor circuit
- fan
- power supply
- heat sink
- air
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 6
- 238000001816 cooling Methods 0.000 abstract 3
- 238000010348 incorporation Methods 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
PURPOSE:To facilitate incorporation into an equipment by installing a semiconductor circuit for power supply to a heat sink with a fan and a fan motor and changing these apparatus into a unit including even a board having a connecting terminal with an external circuit. CONSTITUTION:A fan 2 belongs to one kind of centrifugal fans, and air is sucked to the upper section of the fan 2 bored to a heat-sink upper plate 8 from a suction hole, and forwarded to the outer circumferential section of the fan 2. Air fed by the fan 2 is introduced to a semiconductor circuit 5 for power supply along the flow path of a heat sink 1 with cooling fins. Air cools the semiconductor circuit 5 for power supply and the heat sink 1 with the cooling fins in a process in which air passes through the fin section for the heat sink 1 with the cooling fins and is discharged outside a semiconductor circuit unit for power. Accordingly, the semiconductor circuit for power supply is incorporated easily into an equipment, thus miniaturizing a device, then simplifying maintenance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16998687A JPS6413751A (en) | 1987-07-08 | 1987-07-08 | Semiconductor circuit unit for power supply |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16998687A JPS6413751A (en) | 1987-07-08 | 1987-07-08 | Semiconductor circuit unit for power supply |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413751A true JPS6413751A (en) | 1989-01-18 |
Family
ID=15896478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16998687A Pending JPS6413751A (en) | 1987-07-08 | 1987-07-08 | Semiconductor circuit unit for power supply |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413751A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0319495U (en) * | 1989-07-06 | 1991-02-26 | ||
| JPH09172113A (en) * | 1995-12-18 | 1997-06-30 | Nec Corp | Heat sink for semiconductor device |
| EP0951208A3 (en) * | 1998-04-16 | 2000-04-26 | Fanuc Ltd | Servo amplifier unit |
| US9155224B2 (en) | 2010-04-23 | 2015-10-06 | Napatech A/S | Thermally controlled assembly |
-
1987
- 1987-07-08 JP JP16998687A patent/JPS6413751A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0319495U (en) * | 1989-07-06 | 1991-02-26 | ||
| JPH09172113A (en) * | 1995-12-18 | 1997-06-30 | Nec Corp | Heat sink for semiconductor device |
| US5838066A (en) * | 1995-12-18 | 1998-11-17 | Nec Corporation | Miniaturized cooling fan type heatsink for a semiconductior device |
| EP0951208A3 (en) * | 1998-04-16 | 2000-04-26 | Fanuc Ltd | Servo amplifier unit |
| US6292363B1 (en) | 1998-04-16 | 2001-09-18 | Fanuc Ltd. | Servo amplifier unit |
| US9155224B2 (en) | 2010-04-23 | 2015-10-06 | Napatech A/S | Thermally controlled assembly |
| US9155223B2 (en) | 2010-04-23 | 2015-10-06 | Napatech A/S | Thermally controlled assembly |
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