JPS6414919A - Chucking device - Google Patents
Chucking deviceInfo
- Publication number
- JPS6414919A JPS6414919A JP62169712A JP16971287A JPS6414919A JP S6414919 A JPS6414919 A JP S6414919A JP 62169712 A JP62169712 A JP 62169712A JP 16971287 A JP16971287 A JP 16971287A JP S6414919 A JPS6414919 A JP S6414919A
- Authority
- JP
- Japan
- Prior art keywords
- support
- substrate
- rear face
- flange
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Coating Apparatus (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Abstract
PURPOSE:To prevent a liquid material, such as resist or the like from being introduced to the rear face of a material by providing a rear side cover separably provided from the support on the rear face of a support for a chuck body and having a flange in close contact with an extended rear face of the material at the side of the support when the chuck body approaches the support. CONSTITUTION:Since a substrate 8 is larger than the support 1a of a chuck body 1, its peripheral edge is supported in a state that it is extended outside from the edge of the support 1a. The substrate 8 is fixedly supported onto the surface of the support 1a through an O-ring 7 for attracting the substrate. The differential pressure in a cylinder bore 12a from the atmosphere overcomes the energizing force of a coiled spring 18 so that a piston member 14 is attracted into the bore 12a, a rear side cover 10 approaches the support 1a, and the upper face of a flange 10a is brought into close contact with the rear face 8a of the perlpheral edge of the substrate 8. Liquid resist is dropped on the substrate 8, which is rotated at a high speed and coated therewith. The rear face 8a of the substrate 8 is completely covered by the flange 10a to prevent the resist from being introduced to the rear face 8a of the substrate 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62169712A JPS6414919A (en) | 1987-07-09 | 1987-07-09 | Chucking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62169712A JPS6414919A (en) | 1987-07-09 | 1987-07-09 | Chucking device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6414919A true JPS6414919A (en) | 1989-01-19 |
Family
ID=15891468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62169712A Pending JPS6414919A (en) | 1987-07-09 | 1987-07-09 | Chucking device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6414919A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02277227A (en) * | 1989-04-19 | 1990-11-13 | Hitachi Ltd | Component treatment apparatus |
| JP2007073833A (en) * | 2005-09-08 | 2007-03-22 | Dainippon Screen Mfg Co Ltd | Reduced pressure drying apparatus and substrate drying method |
-
1987
- 1987-07-09 JP JP62169712A patent/JPS6414919A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02277227A (en) * | 1989-04-19 | 1990-11-13 | Hitachi Ltd | Component treatment apparatus |
| JP2007073833A (en) * | 2005-09-08 | 2007-03-22 | Dainippon Screen Mfg Co Ltd | Reduced pressure drying apparatus and substrate drying method |
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