JPS6414919A - Chucking device - Google Patents

Chucking device

Info

Publication number
JPS6414919A
JPS6414919A JP62169712A JP16971287A JPS6414919A JP S6414919 A JPS6414919 A JP S6414919A JP 62169712 A JP62169712 A JP 62169712A JP 16971287 A JP16971287 A JP 16971287A JP S6414919 A JPS6414919 A JP S6414919A
Authority
JP
Japan
Prior art keywords
support
substrate
rear face
flange
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62169712A
Other languages
Japanese (ja)
Inventor
Soichi Matsuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP62169712A priority Critical patent/JPS6414919A/en
Publication of JPS6414919A publication Critical patent/JPS6414919A/en
Pending legal-status Critical Current

Links

Landscapes

  • Coating Apparatus (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

PURPOSE:To prevent a liquid material, such as resist or the like from being introduced to the rear face of a material by providing a rear side cover separably provided from the support on the rear face of a support for a chuck body and having a flange in close contact with an extended rear face of the material at the side of the support when the chuck body approaches the support. CONSTITUTION:Since a substrate 8 is larger than the support 1a of a chuck body 1, its peripheral edge is supported in a state that it is extended outside from the edge of the support 1a. The substrate 8 is fixedly supported onto the surface of the support 1a through an O-ring 7 for attracting the substrate. The differential pressure in a cylinder bore 12a from the atmosphere overcomes the energizing force of a coiled spring 18 so that a piston member 14 is attracted into the bore 12a, a rear side cover 10 approaches the support 1a, and the upper face of a flange 10a is brought into close contact with the rear face 8a of the perlpheral edge of the substrate 8. Liquid resist is dropped on the substrate 8, which is rotated at a high speed and coated therewith. The rear face 8a of the substrate 8 is completely covered by the flange 10a to prevent the resist from being introduced to the rear face 8a of the substrate 8.
JP62169712A 1987-07-09 1987-07-09 Chucking device Pending JPS6414919A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62169712A JPS6414919A (en) 1987-07-09 1987-07-09 Chucking device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62169712A JPS6414919A (en) 1987-07-09 1987-07-09 Chucking device

Publications (1)

Publication Number Publication Date
JPS6414919A true JPS6414919A (en) 1989-01-19

Family

ID=15891468

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62169712A Pending JPS6414919A (en) 1987-07-09 1987-07-09 Chucking device

Country Status (1)

Country Link
JP (1) JPS6414919A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277227A (en) * 1989-04-19 1990-11-13 Hitachi Ltd Component treatment apparatus
JP2007073833A (en) * 2005-09-08 2007-03-22 Dainippon Screen Mfg Co Ltd Reduced pressure drying apparatus and substrate drying method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02277227A (en) * 1989-04-19 1990-11-13 Hitachi Ltd Component treatment apparatus
JP2007073833A (en) * 2005-09-08 2007-03-22 Dainippon Screen Mfg Co Ltd Reduced pressure drying apparatus and substrate drying method

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