JPH02277227A - Component treatment apparatus - Google Patents

Abstract

PURPOSE:To realize a highly clean treatment without a contamination by a method wherein a thick and heavy specimen (semiconductor element) is turned at high speed without becoming eccentric from a revolving shaft and a contamination inhibitor is supplied simultaneously to the rear of the specimen while a prescribed treatment agent is being spouted to the surface. CONSTITUTION:The following are installed: a workpiece holder 1 which is held around a shaft so as to be capable to being turned and in which a recessed hollow part 13 used to set a semiconductor element to be treated is provided in the central part on the surface; a hole 17, for vacuum suction use, which is pierced through the nearly central part of the workpiece holder 1 and which is opened in the recessed hollow part 13; a hole, used to supply a contamination inhibitor, which is opened at the outside of the hole 17 for vacuum suction use at the recessed hollow part. In addition, the following are installed: a radial groove formed in the bottom of the recessed hollow part 13; a means used to turn the workpiece holder 1 on its chaft; a means 27 used to spout a prescribed treatment agent from the upper part of the workpiece holder 1; a means 29 used to supply the inhibitor to the hole used to supply the contamination inhibitor if the workpiece holder 1. Thereby, it is possible to execute a highly clean treatment by which a contamination does not adhere; reliability of a product is enhanced; a production yield is enhanced; it is possible to prevent an operation rate of this apparatus from being lowered when a specimen jumps out; a safe operation can be achieved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a component processing apparatus, and particularly to a component processing apparatus suitable for photoresist development processing to prevent contaminants from adhering to the back surface of a disk-shaped semiconductor element during manufacture. It is related to.

[Conventional technology]

Spin-type etching device: Regarding JP-A No. 62-287625, it is effective because it supplies water, etc. to the back side of the sample to prevent contamination, but since the sample is rotated with the sample set in the holder, during high-speed rotation, the sample may become attached to the holder. There is a high risk of it popping out.

Resist stripping device: Regarding JP-A-63-108721.

It is also an effective technology for preventing contaminants from adhering to the back side of the sample.
In addition, the sample is also vacuum-adsorbed and can be rotated at high speed, but the target sample is a thin-walled and lightweight semiconductor wafer, so even if the central axis and the sample are set with eccentric suction, it will not come off the holder during high-speed rotation. , unsuitable for thick and heavy samples. In the case of a thick-walled, double-weight sample, it is necessary to set the sample in a recess to prevent misalignment during rotation. Even if it is ejected, it will clean the concave holder and will not have a cleaning effect on the back surface of the sample.

[Problem to be solved by the invention]

Etching equipment and photoresist that etches the surface of semiconductor wafers that are in the process of being manufactured! - In the resist coater that coats and forms a thin film, and the developing device that peels off this photoresist and forms a predetermined pattern, it is necessary to spray the anti-contamination agent onto the back surface of the sample by some means. I gave this as an example. Both of these are effective technologies, but in the case of a ``spin etching device,'' it is impossible to adsorb and hold the sample;
1 In the case of apparatus J, the sample is not set in the concave shape and misalignment occurs when spinning a heavy sample, so it is applicable only to thin and lightweight semiconductor wafers. When the sample is set in .

It is impossible to clean the back side.

The purpose of the present invention is to prepare a thick and heavy sample (semiconductor element) by
Parts processing that enables highly clean processing without contamination by rotating at high speed without eccentricity from the central axis of rotation, jetting the specified processing agent onto the surface of the sample and simultaneously supplying anti-contamination agent to the back surface. It is about providing.

(Means for solving one problem) In order to achieve the above object, one aspect of the present invention is as follows.

A work holder is rotatably supported around a central axis and has a recess in the center of its upper surface for setting a semiconductor element to be processed; A vacuum suction hole opening in the recessed portion and a contamination preventive agent supply hole opening outside the recessed portion vacuum suction hole are provided.

Furthermore, a radial groove provided on the bottom surface of the recessed part, a means for rotating the work holder around its central axis, a means for spouting a predetermined processing agent from an upper part of the work holder, and a radial groove provided on the bottom surface of the recessed part; and means for supplying the present inhibitor to the contamination inhibitor supply hole.

[Effect]

In the present invention, a predetermined processing solution (etching solution, developer, etc.) is sprayed and supplied from above the sample, which is held by vacuum suction horizontally and rotating without misalignment with the central axis, to etch the sample surface. processing and photoresist development processing. Normally, after etching, the sample is rotated at high speed after water washing and development to dry the sample, but since the workpiece is set in a recessed workpiece holder and vacuum-adsorbed, even heavy samples may be misaligned. It can be rotated stably without any protrusion. At the same time, in this predetermined processing section, pure water is supplied from the contamination prevention agent supply hole from below through the work holder during etching, and developer is supplied at the same time to peel off the dissolved photoresist during development processing. Undesirable etching due to the liquid entering the lower surface (back surface) of the sample is prevented, and the adhesion of dissolved photoresist residues from the surface is also prevented, making it possible to perform highly clean processing without contamination. Furthermore, since etching, cleaning, drying or development and drying can be carried out continuously in the same device, it is easy to improve work efficiency and automate.

〔Example〕

An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. Fig. 1 is an overall configuration diagram showing an embodiment of the parts processing apparatus of the present invention, Fig. 2 is a plan view of the work holder 1 in Fig. 1 seen from above, and Fig. 3 is a sectional view taken along line AA in Fig. 2. It is.

In Fig. 1, a hollow shaft (servo) motor 2. The rotation speed can be arbitrarily varied. A hollow shaft 4 directly connected to a shaft joint 3 is held by a rotating support 5 having a built-in bearing, and is configured to rotate at a set rotational speed. A work holder 1 is fitted into the upper hole of the hollow shaft 4, and sealed with a ring 6 to prevent a developer, which will be described later, from leaking from the fitting part. Similarly, the hollow shaft 4 is engaged with the housing 7, and an oil seal 8 prevents the developer from leaking. The housing 7, which is integrated with the rotary support 5 and the pipe 9, has an integrated structure with the chamber 10, and is configured to prevent rotation with the hollow shaft 4.

The developer is distributed in pipe 9. Hole 12 in housing 7
Although the details will be described later, the structure is such that the workpiece holder 1 is routed through the workpiece holder 1.

Next, the structure of the work holder 1 will be explained.

The vicinity of the center becomes the recess 13, and the sample 14 is placed on the set surface 15.
It is placed on the guide surface 16 and guided and set. A vacuum hole 17 is provided in the center, which engages with the hollow shaft 4 and forms a vacuum chamber 18 on the end face of the hollow shaft motor 2 (hereinafter abbreviated as motor). The sample 14 reaches the vacuum source via the vacuum piping 19.
will be held by vacuum suction.

Next, the structure of the work holder 1 will be explained with reference to FIGS. 2 and 3. A developer supply hole 20 is formed on the outside of the set surface 15 and is connected to the slot 21. As shown in FIGS. 2 and 3, the work holder 1 is provided with developer supply holes 20 and slots 21 at four locations. Since the water hole 21 is drilled from the outer periphery of the work holder 1 during processing, it is sealed with a plug 21 to prevent leakage. The developing portion supplied from the hole 12 in the housing 7 shown in FIG. 21 and the notch 25. It is discharged from the recess 26 to the radiation section.

At this time, the photoresist film that has been ejected from the nozzle 27 in FIG. 1 and previously formed on the sample 14 (not shown) is peeled off by the developer ejected from the nozzle 27 and flows to the lower surface. .3 The developing solution supplied from the lower surface of the work holder 1 as explained in FIG. When the liquid is ejected, by supplying pure water from the slot 21 on the lower surface of the work holder 1, the etching liquid can enter the lower surface of the sample 14 and prevent undesired etching.

In Figure 1, there is a vacuum solenoid valve 28° and a developer supply solenoid valve 29.
．． Nozzle solenoid valve 30° control circuit 31. A control circuit signal series 32 is shown. These devices have the overall configuration shown in FIG. 1 and perform automatic sequence processing in sequence. Signals according to the program inputted in advance by the control circuit 31 are given to the electromagnetic valves 28, 29, and 30 to perform sequence control and continuous processing.

The method of such sequence processing and the opening/closing steps of the electromagnetic valves 28, 29, and 30 for development processing are well known to those skilled in the art, and a detailed explanation thereof will be omitted. Further, a skirt 33 is provided at the outermost end of the work holder 1 to prevent the developer ejected from the nozzle 27 and the developer supply hole 20 from easily entering the housing 7. Drain pipe 3 connected to 10
It is discharged at 4.

〔Effect of the invention〕

According to the present invention, when a heavy sample is rotated at high speed, it is possible to prevent misalignment and protrusion from the work holder, and it is also possible to supply a contamination prevention agent from the bottom surface, which is contrary to vacuum suction. .

This achieves the prevention of contaminants from adhering to the lower surface of the sample and from undesired etching solution penetration.

The present invention enables highly clean processing without adhesion of contaminants, improves product reliability and manufacturing yield, prevents decrease in device operating rate due to sample ejection, and achieves safe operation.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the overall configuration and control system of an embodiment of the present invention, FIG. 2 is a plan view of a work holder, and FIG. 3 is a sectional view taken along line AA in FIG. 2.

Claims (1)

[Claims] 1. A work holder that is rotatably supported around a central axis and has a recessed part in the center of its upper surface for setting a workpiece, and a work holder that passes through approximately the center of the work holder. a vacuum suction hole opening in the recess, a contamination prevention agent supply hole opening outside the recess vacuum suction hole, and a radial groove provided on the bottom surface of the recess; It is characterized by comprising means for rotating the work holder about its central axis, means for spouting a treatment agent onto the surface of the workpiece, and means for supplying a contamination preventive agent to the back surface of the workpiece. Parts processing equipment. 2. The parts processing apparatus according to claim 1, wherein the anti-contamination agent can be a liquid such as water or an organic solvent, or a gas.