JPS6420743U - - Google Patents
Info
- Publication number
- JPS6420743U JPS6420743U JP1987113828U JP11382887U JPS6420743U JP S6420743 U JPS6420743 U JP S6420743U JP 1987113828 U JP1987113828 U JP 1987113828U JP 11382887 U JP11382887 U JP 11382887U JP S6420743 U JPS6420743 U JP S6420743U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- support plate
- guide
- resin
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/015—Manufacture or treatment of bond wires
- H10W72/01515—Forming coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/075—Connecting or disconnecting of bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は、本考案の第一の実施例である樹脂封
止型半導体装置用リードフレームの平面図、第２
図は第１図のリードフレームを封止樹脂で被覆し
た状態を示す平面図、第３図は第２図のＡ―Ａ線
に沿う断面図で、第４図は本考案の第二の実施例
である樹脂封止型半導体装置用リードフレームの
平面図を示す。
１……樹脂封止型半導体装置用リードフレーム
、２……支持板、２ａ……表面、２ｂ……裏面、
２ｃ……境界部、３……外部リード、４……ガイ
ドリード、５……ベースリード（非接続リード）
、６……コレクタリード（接続リード）、７……
エミツタリード（非接続リード）、１１……切欠
き部、１２……貫通孔、１４……ネジ挿入用孔、
１５……半導体チツプ、１９……溝、２０……樹
脂封止体。
FIG. 1 is a plan view of a lead frame for a resin-sealed semiconductor device, which is a first embodiment of the present invention, and a second embodiment of the present invention.
The figure is a plan view showing the lead frame in Figure 1 covered with a sealing resin, Figure 3 is a sectional view taken along line A-A in Figure 2, and Figure 4 is a second implementation of the present invention. A plan view of an example lead frame for a resin-sealed semiconductor device is shown. DESCRIPTION OF SYMBOLS 1... Lead frame for resin-sealed semiconductor devices, 2... Support plate, 2a... Front surface, 2b... Back surface,
2c... Boundary part, 3... External lead, 4... Guide lead, 5... Base lead (non-connected lead)
, 6... Collector lead (connection lead), 7...
Emitter lead (non-connection lead), 11... Notch, 12... Through hole, 14... Screw insertion hole,
15...Semiconductor chip, 19...Groove, 20...Resin sealing body.
補正 昭６２．８．２６
実用新案登録請求の範囲を次のように補正する
。Amendment August 26, 1982 The scope of claims for utility model registration is amended as follows.
【実用新案登録請求の範囲】
(1) 半導体チツプが固着される表面を備えかつ
貫通孔が形成された複数の支持板と、該支持板の
一端に連結されたガイドリードと、前記支持板の
他端に連結された１本の接続リード及び該接続リ
ードに並行に設けられた非接続リードとを有し、
前記支持板の裏面を含み該支持板が封止樹脂で被
覆される樹脂封止型半導体装置用リードフレーム
において、前記ガイドリードには破断が可能な小
断面部が設けられ、かつ前記ガイドリード側に位
置する前記貫通孔の端部と前記ガイドリード及び
前記支持板の境界部との間に、前記ガイドリード
の導出方向と略直交する成分を有する溝が前記支
持板に設けられていることを特徴とする樹脂封止
型半導体装置用リードフレーム。
(2) 前記溝は前記ガイドリードと前記支持板の
境界部をほぼ包囲するように前記支持板に設けら
れたものである実用新案登録請求の範囲第(1)項
に記載の樹脂封止型半導体装置用リードフレーム
。
(3) 前記小断面部は一対の切欠き部で形成され
たくさび形状を有しかつ該一対の切欠き部の間に
孔が形成されたものである実用新案登録請求の範
囲第(1)項に記載の樹脂封止型半導体装置用リー
ドフレーム。[Claims for Utility Model Registration] (1) A plurality of support plates each having a surface to which a semiconductor chip is fixed and in which a through hole is formed, a guide lead connected to one end of the support plate, and a guide lead connected to one end of the support plate. It has one connection lead connected to the other end and a non-connection lead provided in parallel to the connection lead,
In the lead frame for a resin-sealed semiconductor device, which includes the back surface of the support plate and the support plate is covered with a sealing resin, the guide lead is provided with a breakable small cross-section portion, and the guide lead side A groove having a component substantially perpendicular to a direction in which the guide lead is led out is provided in the support plate between an end of the through hole located at , and a boundary between the guide lead and the support plate. Features: Lead frame for resin-sealed semiconductor devices. (2) The resin-sealed type according to claim 1, wherein the groove is provided in the support plate so as to substantially surround the boundary between the guide lead and the support plate. Lead frame for semiconductor devices. (3) The small cross-section portion has a wedge shape formed by a pair of notches, and a hole is formed between the pair of notches.Claim No. 1 of the Utility Model Registration A lead frame for a resin-sealed semiconductor device as described in 2.
Claims (1)
貫通孔が形成された複数の支持板と、該支持板の
一端に連結されたガイドリードと、前記支持板の
他端に連結された１本の接続リード及び該接続リ
ードに並行に設けられた非接続リードとを有し、
前記支持板の裏面を含み該支持板が封止樹脂で被
覆される樹脂封止型半導体装置用リードフレーム
において、前記ガイドリード側に位置する前記貫
通孔の端部と前記ガイドリード及び前記支持板の
境界部との間に、前記ガイドリードの導出方向と
略直交する成分を有する溝が前記支持板に設けら
れていることを特徴とする樹脂封止型半導体装置
用リードフレーム。 (2) 前記溝は前記ガイドリードと前記支持板の
境界部をほぼ包囲するように前記支持板に設けら
れたものである実用新案登録請求の範囲第(1)項
に記載の樹脂封止型半導体装置用リードフレーム
。 (3) 前記ガイドリードは引張りによる破断が可
能な小断面部を有し、前記小断面部は一対の切欠
き部で形成されたくさび形状を有しかつ該一対の
切欠き部の間に孔が形成されたものである実用新
案登録請求の範囲第(1)項に記載の樹脂封止型半
導体装置用リードフレーム。[Claims for Utility Model Registration] (1) A plurality of support plates each having a surface to which a semiconductor chip is fixed and in which a through hole is formed, a guide lead connected to one end of the support plate, and a guide lead connected to one end of the support plate. It has one connection lead connected to the other end and a non-connection lead provided in parallel to the connection lead,
In a lead frame for a resin-sealed semiconductor device that includes a back surface of the support plate and the support plate is covered with a sealing resin, an end of the through hole located on the guide lead side, the guide lead, and the support plate. A resin-sealed lead frame for a semiconductor device, wherein a groove having a component substantially perpendicular to a direction in which the guide lead is led is provided in the support plate between the support plate and the boundary portion of the guide lead. (2) The resin-sealed type according to claim 1, wherein the groove is provided in the support plate so as to substantially surround the boundary between the guide lead and the support plate. Lead frame for semiconductor devices. (3) The guide lead has a small cross section that can be broken by tension, and the small cross section has a wedge shape formed by a pair of notches, and a hole is provided between the pair of notches. A lead frame for a resin-sealed semiconductor device according to claim (1) of the utility model registration claim, in which the lead frame is formed by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113828U JPH0741165Y2 (en) | 1987-07-27 | 1987-07-27 | Lead frame for resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987113828U JPH0741165Y2 (en) | 1987-07-27 | 1987-07-27 | Lead frame for resin-sealed semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6420743U true JPS6420743U (en) | 1989-02-01 |
| JPH0741165Y2 JPH0741165Y2 (en) | 1995-09-20 |
Family
ID=31354016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987113828U Expired - Lifetime JPH0741165Y2 (en) | 1987-07-27 | 1987-07-27 | Lead frame for resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0741165Y2 (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57155757A (en) * | 1981-03-23 | 1982-09-25 | Hitachi Ltd | Semiconductor device |
| JPS6156420A (en) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | Manufacture of resin-sealed semiconductor device |
-
1987
- 1987-07-27 JP JP1987113828U patent/JPH0741165Y2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57155757A (en) * | 1981-03-23 | 1982-09-25 | Hitachi Ltd | Semiconductor device |
| JPS6156420A (en) * | 1984-07-31 | 1986-03-22 | Sanken Electric Co Ltd | Manufacture of resin-sealed semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0741165Y2 (en) | 1995-09-20 |
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