JPS6422092A - Substrate for high frequency circuit - Google Patents

Substrate for high frequency circuit

Info

Publication number
JPS6422092A
JPS6422092A JP17938487A JP17938487A JPS6422092A JP S6422092 A JPS6422092 A JP S6422092A JP 17938487 A JP17938487 A JP 17938487A JP 17938487 A JP17938487 A JP 17938487A JP S6422092 A JPS6422092 A JP S6422092A
Authority
JP
Japan
Prior art keywords
thickness
system resin
metal layer
circuit
equal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17938487A
Other languages
Japanese (ja)
Inventor
Masami Kamiya
Mitsuo Yokota
Takao Sugawara
Satoshi Tazaki
Yutaka Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP17938487A priority Critical patent/JPS6422092A/en
Publication of JPS6422092A publication Critical patent/JPS6422092A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Landscapes

  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)

Abstract

PURPOSE:To prevent the deterioration of a conductor due to oxidation, by arranging a poly olefine system resin layer having a specified thickness on the metal layer surface forming a circuit, and arranging a poly olefine system resin layer having an average thickness more than or equal to one-half of the thickness of the metal layer forming a circuit on an insulator layer surface. CONSTITUTION:On the surface of a metal layer 1 forming a circuit, a poly olefine system resin layer having an average thickness less than or equal to 4mum. On the surface of an insulator layer 4, an poly olefine system resin layer 7 having an average thickness more than or equal to one-half of the thickness of the metal layer forming a circuit. When the thickness of the poly olefine system resin excess 4mum, antenna characteristics deteriorate. In order not to deteriorate the antenna characteristics, the thickness is desirably as small as possible. When the average thickness is less than or equal to 1/2, the thickness of the poly olefine system resin layer 7 covering the side surface 2 of the metal layer forming a circuit is not sufficient. Therefore, the corner part of the surface 3 and the side surface 2 of the metal layer becomes thin, so that permeation of water content can be hardly prevented. When the average thickness is more than or equal to 1/2, the layer of poly olefine system resin 7 having a sufficient thickness is obtained.
JP17938487A 1987-07-17 1987-07-17 Substrate for high frequency circuit Pending JPS6422092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17938487A JPS6422092A (en) 1987-07-17 1987-07-17 Substrate for high frequency circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17938487A JPS6422092A (en) 1987-07-17 1987-07-17 Substrate for high frequency circuit

Publications (1)

Publication Number Publication Date
JPS6422092A true JPS6422092A (en) 1989-01-25

Family

ID=16064917

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17938487A Pending JPS6422092A (en) 1987-07-17 1987-07-17 Substrate for high frequency circuit

Country Status (1)

Country Link
JP (1) JPS6422092A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998056011A1 (en) * 1997-06-06 1998-12-10 Nippon Zeon Co., Ltd. Insulating materials containing cycloolefinic polymers
JP2013239511A (en) * 2012-05-14 2013-11-28 Mitsubishi Electric Corp Multi-layer board, print circuit board, semiconductor package board, semiconductor package, semiconductor chip, semiconductor device, information processing apparatus, and communication device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998056011A1 (en) * 1997-06-06 1998-12-10 Nippon Zeon Co., Ltd. Insulating materials containing cycloolefinic polymers
US6713154B1 (en) 1997-06-06 2004-03-30 Nippon Zeon Co., Ltd. Insulating material containing cycloolefin polymer
JP2013239511A (en) * 2012-05-14 2013-11-28 Mitsubishi Electric Corp Multi-layer board, print circuit board, semiconductor package board, semiconductor package, semiconductor chip, semiconductor device, information processing apparatus, and communication device

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