JPS6422096A - Manufacture of printed wiring board - Google Patents

Manufacture of printed wiring board

Info

Publication number
JPS6422096A
JPS6422096A JP17820687A JP17820687A JPS6422096A JP S6422096 A JPS6422096 A JP S6422096A JP 17820687 A JP17820687 A JP 17820687A JP 17820687 A JP17820687 A JP 17820687A JP S6422096 A JPS6422096 A JP S6422096A
Authority
JP
Japan
Prior art keywords
ink
hole
poise
printing
solder resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17820687A
Other languages
Japanese (ja)
Other versions
JPH073911B2 (en
Inventor
Keiji Miyajima
Toshio Yokoyama
Shigeru Eda
Takao Nawata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP62178206A priority Critical patent/JPH073911B2/en
Publication of JPS6422096A publication Critical patent/JPS6422096A/en
Publication of JPH073911B2 publication Critical patent/JPH073911B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To prevent smear and thin spot, by performing screen-printing of solder resist ink with (specified) viscosity or of component marking ink, only on the part where a tent is pitched by using a pattern whose diameter is larger than that of a through hole by a specified range. CONSTITUTION:Ordinary solder resist printing is performed with clear for a tenting through hole part (section 7). Then screen-printing is performed with a diameter larger than that of the through hole by 0.03-1.0mm to obtain a tenting film 8. For ink 5 to be used, solder resist ink 5 or component marking ink is desirable, and for its viscosity, the range of 100-2000 poise is preferable. When it is less than 100 poise, the ink is apt to flow into the hole, and the mask is hardly formed. When it is larger than 2000 poise, the output of the ink is small, and grinding becomes inferior, so that a tenting film is difficult to be formed.
JP62178206A 1987-07-17 1987-07-17 Printed circuit board manufacturing method Expired - Fee Related JPH073911B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62178206A JPH073911B2 (en) 1987-07-17 1987-07-17 Printed circuit board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62178206A JPH073911B2 (en) 1987-07-17 1987-07-17 Printed circuit board manufacturing method

Publications (2)

Publication Number Publication Date
JPS6422096A true JPS6422096A (en) 1989-01-25
JPH073911B2 JPH073911B2 (en) 1995-01-18

Family

ID=16044433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62178206A Expired - Fee Related JPH073911B2 (en) 1987-07-17 1987-07-17 Printed circuit board manufacturing method

Country Status (1)

Country Link
JP (1) JPH073911B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0918120A (en) * 1995-06-29 1997-01-17 Nec Corp Printed wiring board and manufacturing method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549770A (en) * 1977-06-24 1979-01-24 Hitachi Ltd Screen print process for print wire board
JPS61234595A (en) * 1985-04-10 1986-10-18 三菱電機株式会社 Printed wiring board
JPS6276556U (en) * 1985-10-31 1987-05-16

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS549770A (en) * 1977-06-24 1979-01-24 Hitachi Ltd Screen print process for print wire board
JPS61234595A (en) * 1985-04-10 1986-10-18 三菱電機株式会社 Printed wiring board
JPS6276556U (en) * 1985-10-31 1987-05-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0918120A (en) * 1995-06-29 1997-01-17 Nec Corp Printed wiring board and manufacturing method thereof

Also Published As

Publication number Publication date
JPH073911B2 (en) 1995-01-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees