JPS642329A - Resin sealing metallic mold - Google Patents

Resin sealing metallic mold

Info

Publication number
JPS642329A
JPS642329A JP15806387A JP15806387A JPS642329A JP S642329 A JPS642329 A JP S642329A JP 15806387 A JP15806387 A JP 15806387A JP 15806387 A JP15806387 A JP 15806387A JP S642329 A JPS642329 A JP S642329A
Authority
JP
Japan
Prior art keywords
resin
cavity
filled
vent
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15806387A
Other languages
Japanese (ja)
Other versions
JPH012329A (en
Inventor
Hiroyuki Ota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP15806387A priority Critical patent/JPS642329A/en
Publication of JPH012329A publication Critical patent/JPH012329A/en
Publication of JPS642329A publication Critical patent/JPS642329A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To assure a resin sealing process with high precision without any cavity or recession at all avoiding any region not filled with resin yet by a method wherein a vent running outside is provided on the part near the final filled in part of a cavity. CONSTITUTION:A leadframe 7 loaded with a semiconductor chip 6 is fixed on the fitting surface of a top force 1 and a bottom force 2 while resin is filled in a cavity 3 from a gate 4 through a filling route 8. The air inside the cavity 3 is exhausted outside through a vent 5 as the resin is filled in the cavity 3 to make the resin filling process smooth. Furthermore, if the resin filling process is stopped with excessive resin filled in the vent 5, there is no risk of causing any region not filled yet inside the cavity 3.
JP15806387A 1987-06-24 1987-06-24 Resin sealing metallic mold Pending JPS642329A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15806387A JPS642329A (en) 1987-06-24 1987-06-24 Resin sealing metallic mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15806387A JPS642329A (en) 1987-06-24 1987-06-24 Resin sealing metallic mold

Publications (2)

Publication Number Publication Date
JPH012329A JPH012329A (en) 1989-01-06
JPS642329A true JPS642329A (en) 1989-01-06

Family

ID=15663488

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15806387A Pending JPS642329A (en) 1987-06-24 1987-06-24 Resin sealing metallic mold

Country Status (1)

Country Link
JP (1) JPS642329A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0482236A (en) * 1990-07-25 1992-03-16 Toowa Kk Method and apparatus for resin sealing and molding of electronic component
JP2010258049A (en) * 2009-04-22 2010-11-11 Sanyo Electric Co Ltd Solid electrolytic capacitor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0482236A (en) * 1990-07-25 1992-03-16 Toowa Kk Method and apparatus for resin sealing and molding of electronic component
JP2010258049A (en) * 2009-04-22 2010-11-11 Sanyo Electric Co Ltd Solid electrolytic capacitor

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