JPS6448432A - Molding die and manufacture of semiconductor device by using said die - Google Patents
Molding die and manufacture of semiconductor device by using said dieInfo
- Publication number
- JPS6448432A JPS6448432A JP20407287A JP20407287A JPS6448432A JP S6448432 A JPS6448432 A JP S6448432A JP 20407287 A JP20407287 A JP 20407287A JP 20407287 A JP20407287 A JP 20407287A JP S6448432 A JPS6448432 A JP S6448432A
- Authority
- JP
- Japan
- Prior art keywords
- air
- corners
- package
- semiconductor device
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 3
- 238000000465 moulding Methods 0.000 title abstract 2
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000012778 molding material Substances 0.000 abstract 2
- 238000007493 shaping process Methods 0.000 abstract 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
PURPOSE:To reduce the adhesion of a molding material onto an outer lead by forming air vent holes to a top force and a bottom force so that air is taken out of the eight corners of a package for a semiconductor device. CONSTITUTION:First air vent holes 4 are shaped at the four corners of a section forming the top face of a package 13 in an upper cavity 3, air in the upper cavity 3 passes through the outside of a top force 2, second air vent holes 7 are shaped at the four corners of a section forming the underside of the package in a lower cavity 6, and air in the lower cavity 6 passes through the outside of a bottom force 5. Consequently, air passing at the time of molding passes from the eight corners of cavities 3, 6 for shaping the package 13, thus preventing passing-through from outer leads 15 for a semiconductor device 12. Accordingly, the adhesion of a molding material onto the outer leads 15 can be reduced.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20407287A JPS6448432A (en) | 1987-08-19 | 1987-08-19 | Molding die and manufacture of semiconductor device by using said die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20407287A JPS6448432A (en) | 1987-08-19 | 1987-08-19 | Molding die and manufacture of semiconductor device by using said die |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6448432A true JPS6448432A (en) | 1989-02-22 |
Family
ID=16484301
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20407287A Pending JPS6448432A (en) | 1987-08-19 | 1987-08-19 | Molding die and manufacture of semiconductor device by using said die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6448432A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02121910U (en) * | 1989-03-20 | 1990-10-04 | ||
| JPH05196173A (en) * | 1991-11-27 | 1993-08-06 | Fuji Seiki Kk | Vacuum slide valve |
| US11879506B2 (en) | 2018-08-09 | 2024-01-23 | Eagle Industry Co., Ltd. | Coupling |
-
1987
- 1987-08-19 JP JP20407287A patent/JPS6448432A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02121910U (en) * | 1989-03-20 | 1990-10-04 | ||
| JPH05196173A (en) * | 1991-11-27 | 1993-08-06 | Fuji Seiki Kk | Vacuum slide valve |
| US11879506B2 (en) | 2018-08-09 | 2024-01-23 | Eagle Industry Co., Ltd. | Coupling |
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