JPS6425732A - Electric power semiconductor device module and manufacture - Google Patents

Electric power semiconductor device module and manufacture

Info

Publication number
JPS6425732A
JPS6425732A JP63053848A JP5384888A JPS6425732A JP S6425732 A JPS6425732 A JP S6425732A JP 63053848 A JP63053848 A JP 63053848A JP 5384888 A JP5384888 A JP 5384888A JP S6425732 A JPS6425732 A JP S6425732A
Authority
JP
Japan
Prior art keywords
frame
sheet
electroconductive material
metallic plate
interim
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63053848A
Other languages
English (en)
Inventor
Perunichiaro Supatoriz Antonio
Gandorufui Ruchiaano
Minotsutei Karuro
Dei Kurisuteina Nataare
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
STMicroelectronics lnc USA
Original Assignee
SGS Thomson Microelectronics SRL
SGS Thomson Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SGS Thomson Microelectronics SRL, SGS Thomson Microelectronics Inc filed Critical SGS Thomson Microelectronics SRL
Publication of JPS6425732A publication Critical patent/JPS6425732A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP63053848A 1987-03-09 1988-03-09 Electric power semiconductor device module and manufacture Pending JPS6425732A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT19630/87A IT1202657B (it) 1987-03-09 1987-03-09 Procedimento di fabbricazione di un dispositivo modulare di potenza a semiconduttore e dispositivo con esso ottenento

Publications (1)

Publication Number Publication Date
JPS6425732A true JPS6425732A (en) 1989-01-27

Family

ID=11159882

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63053848A Pending JPS6425732A (en) 1987-03-09 1988-03-09 Electric power semiconductor device module and manufacture

Country Status (5)

Country Link
US (4) US4926547A (ja)
EP (1) EP0282124B1 (ja)
JP (1) JPS6425732A (ja)
DE (1) DE3884019T2 (ja)
IT (1) IT1202657B (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5233583A (en) * 1990-12-19 1993-08-03 General Electric Company Tracking and reading system for an optical medium and medium for use therewith

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1202657B (it) * 1987-03-09 1989-02-09 Sgs Microelettronica Spa Procedimento di fabbricazione di un dispositivo modulare di potenza a semiconduttore e dispositivo con esso ottenento
DE3837920A1 (de) * 1988-11-09 1990-05-10 Semikron Elektronik Gmbh Halbleiterelement
JP2504610B2 (ja) * 1990-07-26 1996-06-05 株式会社東芝 電力用半導体装置
JPH05166969A (ja) * 1991-10-14 1993-07-02 Fuji Electric Co Ltd 半導体装置
US5705848A (en) * 1995-11-24 1998-01-06 Asea Brown Boveri Ag Power semiconductor module having a plurality of submodules
JP3491481B2 (ja) * 1996-08-20 2004-01-26 株式会社日立製作所 半導体装置とその製造方法
US5736432A (en) * 1996-09-20 1998-04-07 National Semiconductor Corporation Lead frame with lead finger locking feature and method for making same
US6534851B1 (en) * 2000-08-21 2003-03-18 Agere Systems, Inc. Modular semiconductor substrates
US8422243B2 (en) * 2006-12-13 2013-04-16 Stats Chippac Ltd. Integrated circuit package system employing a support structure with a recess
CN118053822B (zh) * 2024-04-16 2024-08-06 四川职业技术学院 一种电源管理芯片的封装结构及封装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578756B2 (ja) * 1976-09-21 1982-02-18
JPS6092650A (ja) * 1983-10-27 1985-05-24 Toshiba Corp 半導体装置

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1255073A (en) * 1969-05-20 1971-11-24 Ferranti Ltd Improvements relating to electrical circuit assemblies
US4026008A (en) * 1972-10-02 1977-05-31 Signetics Corporation Semiconductor lead structure and assembly and method for fabricating same
US4106052A (en) * 1975-04-19 1978-08-08 Semikron Gesellschaft Fur Gleichrichterbau Und Elektronik M.B.H. Semiconductor rectifier unit having a base plate with means for maintaining insulating wafers in a desired position
US4102039A (en) * 1977-02-14 1978-07-25 Motorola, Inc. Method of packaging electronic components
FR2495376A1 (fr) * 1980-12-02 1982-06-04 Thomson Csf Boitiers pour composants semiconducteurs de puissance a cosses de type faston
US4396936A (en) * 1980-12-29 1983-08-02 Honeywell Information Systems, Inc. Integrated circuit chip package with improved cooling means
US4518982A (en) * 1981-02-27 1985-05-21 Motorola, Inc. High current package with multi-level leads
GB2099742B (en) * 1981-06-05 1985-07-31 Philips Electronic Associated Bonding metals to non-metals
FR2524707B1 (fr) * 1982-04-01 1985-05-31 Cit Alcatel Procede d'encapsulation de composants semi-conducteurs, et composants encapsules obtenus
US4615031A (en) * 1982-07-27 1986-09-30 International Standard Electric Corporation Injection laser packages
JPS5968958A (ja) * 1982-10-12 1984-04-19 Mitsubishi Electric Corp ゲ−トタ−ンオフサイリスタ組立体
JPS59181627A (ja) * 1983-03-31 1984-10-16 Toshiba Corp 半導体装置の製造方法
US4722060A (en) * 1984-03-22 1988-01-26 Thomson Components-Mostek Corporation Integrated-circuit leadframe adapted for a simultaneous bonding operation
US4675989A (en) * 1984-05-11 1987-06-30 Amp Incorporated Method of making an electrical circuit package
JPS60239051A (ja) * 1984-05-11 1985-11-27 Mitsubishi Electric Corp 半導体装置
US4635356A (en) * 1984-12-28 1987-01-13 Kabushiki Kaisha Toshiba Method of manufacturing a circuit module
IT1185410B (it) * 1985-10-10 1987-11-12 Sgs Microelettronica Spa Metodo e contenitore perfezionato per dissipare il calore generato da una piastrina a circuito integrato
IT1202657B (it) * 1987-03-09 1989-02-09 Sgs Microelettronica Spa Procedimento di fabbricazione di un dispositivo modulare di potenza a semiconduttore e dispositivo con esso ottenento
US4783428A (en) * 1987-11-23 1988-11-08 Motorola Inc. Method of producing a thermogenetic semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS578756B2 (ja) * 1976-09-21 1982-02-18
JPS6092650A (ja) * 1983-10-27 1985-05-24 Toshiba Corp 半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5233583A (en) * 1990-12-19 1993-08-03 General Electric Company Tracking and reading system for an optical medium and medium for use therewith

Also Published As

Publication number Publication date
US5038198A (en) 1991-08-06
USRE37416E1 (en) 2001-10-23
DE3884019T2 (de) 1994-02-03
DE3884019D1 (de) 1993-10-21
US4926547A (en) 1990-05-22
USRE38037E1 (en) 2003-03-18
EP0282124A2 (en) 1988-09-14
IT1202657B (it) 1989-02-09
EP0282124B1 (en) 1993-09-15
EP0282124A3 (en) 1989-03-22
IT8719630A0 (it) 1987-03-09

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