JPS6427254A - Semiconductor integrated circuit device - Google Patents
Semiconductor integrated circuit deviceInfo
- Publication number
- JPS6427254A JPS6427254A JP62183891A JP18389187A JPS6427254A JP S6427254 A JPS6427254 A JP S6427254A JP 62183891 A JP62183891 A JP 62183891A JP 18389187 A JP18389187 A JP 18389187A JP S6427254 A JPS6427254 A JP S6427254A
- Authority
- JP
- Japan
- Prior art keywords
- buried
- epitaxial layer
- type epitaxial
- layer
- type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/40—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00 with at least one component covered by groups H10D10/00 or H10D18/00, e.g. integration of IGFETs with BJTs
- H10D84/401—Combinations of FETs or IGBTs with BJTs
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
Abstract
PURPOSE:To thin an n-type epitaxial layer, and to increase the working speed of an n-p-n bipolar-transistor by independently forming a p<+> buried layer at a place deeper than the n-type epitaxial layer regardless of the film thickness of the n-type epitaxial layer shaping the bipolar-transistor. CONSTITUTION:A p<+> buried layer 5 is buried deeply to a p-type silicon substrate 1, and n<+> buried layers 3, 4 are buried onto a p-type epitaxial layer 10 formed onto the p-type silicon substrate 1. Consequently, the n<+> buried layers 3, 4 are formed where higher than the p-type silicon substrate 1 only by a section controlled by the thickness of the p-type epitaxial layer 10, and the p<+> buried layer 5 is shaped where lower than the n<+> buried layers 3, 4 only by the section relatively. That is, the relative positional relationship of the n<+> buried layers and p<+> buried layer is set arbitrarily by the film thickness of the p-type epitaxial layer 10 regardless of the film thickness of an n-type epitaxial layer 2. Accordingly, a semiconductor integrated circuit device having double well-Bi-CMOS structure capable of attaining the thinning of the epitaxial layer is acquired.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62183891A JPS6427254A (en) | 1987-07-22 | 1987-07-22 | Semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62183891A JPS6427254A (en) | 1987-07-22 | 1987-07-22 | Semiconductor integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6427254A true JPS6427254A (en) | 1989-01-30 |
Family
ID=16143621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62183891A Pending JPS6427254A (en) | 1987-07-22 | 1987-07-22 | Semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6427254A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5121185A (en) * | 1987-10-09 | 1992-06-09 | Hitachi, Ltd. | Monolithic semiconductor IC device including blocks having different functions with different breakdown voltages |
| EP0746033A3 (en) * | 1995-06-02 | 1999-06-02 | Texas Instruments Incorporated | Improvements in or relating to semiconductor processing |
-
1987
- 1987-07-22 JP JP62183891A patent/JPS6427254A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5121185A (en) * | 1987-10-09 | 1992-06-09 | Hitachi, Ltd. | Monolithic semiconductor IC device including blocks having different functions with different breakdown voltages |
| EP0746033A3 (en) * | 1995-06-02 | 1999-06-02 | Texas Instruments Incorporated | Improvements in or relating to semiconductor processing |
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