JPS642857A - Method and device for polishing wafer - Google Patents

Method and device for polishing wafer

Info

Publication number
JPS642857A
JPS642857A JP62272658A JP27265887A JPS642857A JP S642857 A JPS642857 A JP S642857A JP 62272658 A JP62272658 A JP 62272658A JP 27265887 A JP27265887 A JP 27265887A JP S642857 A JPS642857 A JP S642857A
Authority
JP
Japan
Prior art keywords
plate
wafer
pressure
fluid
gluing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62272658A
Other languages
Japanese (ja)
Other versions
JPH0741534B2 (en
JPH012857A (en
Inventor
Satoru Kitsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikoshi Machinery Corp
Original Assignee
Fujikoshi Kikai Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikoshi Kikai Kogyo KK filed Critical Fujikoshi Kikai Kogyo KK
Priority to JP62272658A priority Critical patent/JPH0741534B2/en
Priority to US07/262,952 priority patent/US4918869A/en
Publication of JPS642857A publication Critical patent/JPS642857A/en
Publication of JPH012857A publication Critical patent/JPH012857A/en
Publication of JPH0741534B2 publication Critical patent/JPH0741534B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE:To enable a wafer to be high accurately polished by gluing the wafer to the bottom surface of a rotatable plate and applying the predetermined pressure of fluid uniformly acting on the upper surface of the plate so that the plate substantially eliminates its flexing deformation holding flatness to a high degree. CONSTITUTION:A polishing device, gluing a wafer W to the bottom surface of a plate 1, placing it on a turn table 3 with this wafer glued surface in the bottom and pressing the plate 1 by a top ring 8 forming its bottom part into a reversed dish shape, performs mirror polishing of the wafer W by relatively slipping the wafer W with the turn table 3. The device, which provides a flexible thin film (pressing plate) 11 extending in the bottom surface or the top ring 8 to form enclosed space 12, presses the plate 1 by supplying pressure fluid to the enclosed space 12 from a fluid supply source. The pressure of this pressure fluid is adjusted by a pressure adjusting mechanism 13, and the device, applying a uniform pressure acting on the upper surface of the plate 1 and placing it in a condition generating no flexing deformation, polishes the wafer with high accuracy.
JP62272658A 1986-11-10 1987-10-28 Wafer polishing method and polishing apparatus Expired - Fee Related JPH0741534B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62272658A JPH0741534B2 (en) 1986-11-10 1987-10-28 Wafer polishing method and polishing apparatus
US07/262,952 US4918869A (en) 1987-10-28 1988-10-26 Method for lapping a wafer material and an apparatus therefor

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP61-267268 1986-11-10
JP26726886 1986-11-10
JP62272658A JPH0741534B2 (en) 1986-11-10 1987-10-28 Wafer polishing method and polishing apparatus

Publications (3)

Publication Number Publication Date
JPS642857A true JPS642857A (en) 1989-01-06
JPH012857A JPH012857A (en) 1989-01-06
JPH0741534B2 JPH0741534B2 (en) 1995-05-10

Family

ID=26547789

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62272658A Expired - Fee Related JPH0741534B2 (en) 1986-11-10 1987-10-28 Wafer polishing method and polishing apparatus

Country Status (1)

Country Link
JP (1) JPH0741534B2 (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5129714A (en) * 1989-10-06 1992-07-14 Alfred Teves Gmbh Anti-lock hydraulic brake system with hydraulically controlled inlet valve
US5791973A (en) * 1995-04-10 1998-08-11 Matsushita Electric Industrial Co., Ltd. Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6039638A (en) * 1997-02-06 2000-03-21 Speedfam Co., Ltd. Work planarizing method and apparatus
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
JP2007268422A (en) * 2006-03-31 2007-10-18 Disco Abrasive Syst Ltd Resin coating method and coating apparatus

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444299A (en) * 1977-09-13 1979-04-07 Uingoo Kk Grinding method and apparatus

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5444299A (en) * 1977-09-13 1979-04-07 Uingoo Kk Grinding method and apparatus

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5129714A (en) * 1989-10-06 1992-07-14 Alfred Teves Gmbh Anti-lock hydraulic brake system with hydraulically controlled inlet valve
US5791973A (en) * 1995-04-10 1998-08-11 Matsushita Electric Industrial Co., Ltd. Apparatus for holding substrate to be polished and apparatus and method for polishing substrate
US5921853A (en) * 1995-04-10 1999-07-13 Matsushita Electric Industrial Co., Ltd. Apparatus for polishing substrate using resin film or multilayer polishing pad
US6039638A (en) * 1997-02-06 2000-03-21 Speedfam Co., Ltd. Work planarizing method and apparatus
US5993302A (en) * 1997-12-31 1999-11-30 Applied Materials, Inc. Carrier head with a removable retaining ring for a chemical mechanical polishing apparatus
US6080050A (en) * 1997-12-31 2000-06-27 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
US6277009B1 (en) 1997-12-31 2001-08-21 Applied Materials, Inc. Carrier head including a flexible membrane and a compliant backing member for a chemical mechanical polishing apparatus
JP2007268422A (en) * 2006-03-31 2007-10-18 Disco Abrasive Syst Ltd Resin coating method and coating apparatus

Also Published As

Publication number Publication date
JPH0741534B2 (en) 1995-05-10

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