JPS6430237A - Manufacture of resin-sealed semiconductor device - Google Patents

Manufacture of resin-sealed semiconductor device

Info

Publication number
JPS6430237A
JPS6430237A JP18718887A JP18718887A JPS6430237A JP S6430237 A JPS6430237 A JP S6430237A JP 18718887 A JP18718887 A JP 18718887A JP 18718887 A JP18718887 A JP 18718887A JP S6430237 A JPS6430237 A JP S6430237A
Authority
JP
Japan
Prior art keywords
resin
protrusions
protrusion
cavity part
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18718887A
Other languages
Japanese (ja)
Other versions
JP2532490B2 (en
Inventor
Yutaka Iso
Toshikuni Miyamoto
Shigeki Inumaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP62187188A priority Critical patent/JP2532490B2/en
Publication of JPS6430237A publication Critical patent/JPS6430237A/en
Application granted granted Critical
Publication of JP2532490B2 publication Critical patent/JP2532490B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

PURPOSE:To stop a resin flow to flow out of a cavity part in the vicinity of a tie bar and to make it possible to peel easily resin thin pieces adhered on the surfaces of leads in the latter process by a method wherein a metal mold is provided with two protrusions and these protrusions are respectively pressed to the tie bar of a lead frame and on the lead frame in the vicinity of the cavity part. CONSTITUTION:First and second protrusions 1a and 1b are provided on the lower surface of a top metal mold 1, the protrusion 1a is pressed to the end part of a tie bar 4a and the second protrusion 1b is pressed to the surface of a lead frame 4 in the immediate vicinity of a cavity part 3. In this state, when a fused resin is poured in the cavity part 3, a package 6 for protecting a semiconductor chip 5 is formed of the filled resin. At this time, part of the resin intrudes between the first and second protrusions 1a and 1b as well and a thin piece is formed. However, this thin piece does not leak outside from the protrusion 1a and moreover, is interrupted from the package 6 by the protrusion 1b. Then, when leads 4b are bent at the time of bent processing, thin pieces 7a separated from the package 6 are peeled naturally according to the bending of the leads 4b.
JP62187188A 1987-07-27 1987-07-27 Method for manufacturing resin-sealed semiconductor device Expired - Lifetime JP2532490B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62187188A JP2532490B2 (en) 1987-07-27 1987-07-27 Method for manufacturing resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62187188A JP2532490B2 (en) 1987-07-27 1987-07-27 Method for manufacturing resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS6430237A true JPS6430237A (en) 1989-02-01
JP2532490B2 JP2532490B2 (en) 1996-09-11

Family

ID=16201647

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62187188A Expired - Lifetime JP2532490B2 (en) 1987-07-27 1987-07-27 Method for manufacturing resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JP2532490B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60175079A (en) * 1984-02-21 1985-09-09 株式会社ナムコ Driver using curved shaft
US20130341779A1 (en) * 2012-06-25 2013-12-26 Mitsubishi Electric Corporation Method of manufacturing a semiconductor device and semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562642A (en) * 1979-06-22 1981-01-12 Mitsubishi Electric Corp Device for forming resin-sealed semiconductor device
JPS63314841A (en) * 1987-06-17 1988-12-22 Nec Yamagata Ltd Metal mold for resin seal of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS562642A (en) * 1979-06-22 1981-01-12 Mitsubishi Electric Corp Device for forming resin-sealed semiconductor device
JPS63314841A (en) * 1987-06-17 1988-12-22 Nec Yamagata Ltd Metal mold for resin seal of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60175079A (en) * 1984-02-21 1985-09-09 株式会社ナムコ Driver using curved shaft
US20130341779A1 (en) * 2012-06-25 2013-12-26 Mitsubishi Electric Corporation Method of manufacturing a semiconductor device and semiconductor device

Also Published As

Publication number Publication date
JP2532490B2 (en) 1996-09-11

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