JPS5752155A - Manufacture of resin sealed semiconductor device - Google Patents

Manufacture of resin sealed semiconductor device

Info

Publication number
JPS5752155A
JPS5752155A JP55128215A JP12821580A JPS5752155A JP S5752155 A JPS5752155 A JP S5752155A JP 55128215 A JP55128215 A JP 55128215A JP 12821580 A JP12821580 A JP 12821580A JP S5752155 A JPS5752155 A JP S5752155A
Authority
JP
Japan
Prior art keywords
resin
semiconductor device
sealing
frame
copper
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55128215A
Other languages
Japanese (ja)
Inventor
Kunihito Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP55128215A priority Critical patent/JPS5752155A/en
Publication of JPS5752155A publication Critical patent/JPS5752155A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To simplify the burr removing work of a semiconductor device and to reduce the curing stress of the resin upon sealing by exposing the part not formed with the sealing resin for a lead frame on the surface with copper metal. CONSTITUTION:A lead frame 7 made of a frame 8, a lead strip 9 and a tie bar 10, etc. are made of copper or copper alloy, a semiconductor pellet is mounted on the die bonding part of the frame 7, and when the pellet is molded with resin 12 (13 represents burr), copper metal is exposed on the surface of the part not formed with the resin. In this manner, the gelling time of the part contacted with the metal of the resin can be increased to facilitate the burr removing work and the curing stress of the resin sealing can be reduced.
JP55128215A 1980-09-16 1980-09-16 Manufacture of resin sealed semiconductor device Pending JPS5752155A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55128215A JPS5752155A (en) 1980-09-16 1980-09-16 Manufacture of resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55128215A JPS5752155A (en) 1980-09-16 1980-09-16 Manufacture of resin sealed semiconductor device

Publications (1)

Publication Number Publication Date
JPS5752155A true JPS5752155A (en) 1982-03-27

Family

ID=14979334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55128215A Pending JPS5752155A (en) 1980-09-16 1980-09-16 Manufacture of resin sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5752155A (en)

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