JPS6430834U - - Google Patents

Info

Publication number
JPS6430834U
JPS6430834U JP12679787U JP12679787U JPS6430834U JP S6430834 U JPS6430834 U JP S6430834U JP 12679787 U JP12679787 U JP 12679787U JP 12679787 U JP12679787 U JP 12679787U JP S6430834 U JPS6430834 U JP S6430834U
Authority
JP
Japan
Prior art keywords
wiring board
metal ball
lead
semiconductor device
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12679787U
Other languages
Japanese (ja)
Other versions
JPH0625959Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12679787U priority Critical patent/JPH0625959Y2/en
Publication of JPS6430834U publication Critical patent/JPS6430834U/ja
Application granted granted Critical
Publication of JPH0625959Y2 publication Critical patent/JPH0625959Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は、本考案に係る一実施例を示した平面
図、第２図は、同じく部分断面図である。第３図
は、ハイブリツドＩＣの組立分解斜視図、第４図
は、同じく組立完了斜視図、第５図乃至第７図は
、リードフレーム等を樹脂にて封止する際の各動
作状態での部分断面図、第８図は、樹脂モールド
の際に生じる問題点を図示した部分断面図である
。 １……配線基板、３……素子、５……リードフ
レーム、５ｂ……リード、６……ワイヤ、６ａ…
…金属球、７……絶縁板、１３……溶融樹脂。 FIG. 1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a partial sectional view of the same. Fig. 3 is an exploded perspective view of the hybrid IC, Fig. 4 is a perspective view of the completed assembly, and Figs. 5 to 7 show the various operating states when sealing the lead frame etc. with resin. FIG. 8 is a partial cross-sectional view illustrating problems that occur during resin molding. DESCRIPTION OF SYMBOLS 1... Wiring board, 3... Element, 5... Lead frame, 5b... Lead, 6... Wire, 6a...
... Metal ball, 7 ... Insulating plate, 13 ... Molten resin.

Claims (1)

【実用新案登録請求の範囲】 素子をマウントした配線基板と、前記配線基板
の周囲に複数本平行配置したリードの内端とを、
一方のみ金属球を形成してワイヤボンデイングし
、上記素子とリードの内端とを含む主要部を樹脂
にて封止した半導体装置において、 上記金属球を一部又は全部をリード側に配置し
て、ワイヤボンデイングしたことを特徴とする半
導体装置。[Claims for Utility Model Registration] A wiring board on which an element is mounted, and inner ends of a plurality of leads arranged in parallel around the wiring board,
In a semiconductor device in which a metal ball is formed on only one side and wire bonded, and the main part including the element and the inner end of the lead is sealed with resin, the metal ball is partially or completely disposed on the lead side. , a semiconductor device characterized by wire bonding.
JP12679787U 1987-08-19 1987-08-19 Semiconductor device Expired - Lifetime JPH0625959Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12679787U JPH0625959Y2 (en) 1987-08-19 1987-08-19 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12679787U JPH0625959Y2 (en) 1987-08-19 1987-08-19 Semiconductor device

Publications (2)

Publication Number Publication Date
JPS6430834U true JPS6430834U (en) 1989-02-27
JPH0625959Y2 JPH0625959Y2 (en) 1994-07-06

Family

ID=31378640

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12679787U Expired - Lifetime JPH0625959Y2 (en) 1987-08-19 1987-08-19 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0625959Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159746A (en) * 1985-01-08 1986-07-19 Kyodo Printing Co Ltd Wire bonding method for ic module

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159746A (en) * 1985-01-08 1986-07-19 Kyodo Printing Co Ltd Wire bonding method for ic module

Also Published As

Publication number Publication date
JPH0625959Y2 (en) 1994-07-06

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