JPH0436251U - - Google Patents
Info
- Publication number
- JPH0436251U JPH0436251U JP7841390U JP7841390U JPH0436251U JP H0436251 U JPH0436251 U JP H0436251U JP 7841390 U JP7841390 U JP 7841390U JP 7841390 U JP7841390 U JP 7841390U JP H0436251 U JPH0436251 U JP H0436251U
- Authority
- JP
- Japan
- Prior art keywords
- discrete component
- semiconductor element
- terminal
- lead frame
- mounting lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の一実施例に係る樹脂封止型電
力用半導体装置の縦断側面図、第２図は同じくそ
の横断平面図、第３図は従来の樹脂封止型半導体
装置の縦断側面図、第４図は同じくその横断面図
である。
１１……リードフレーム、１２……半導体素子
、１３……フオトカプラ、１４……はんだ、１５
……ボンデイングワイヤー、１６……絶縁封止樹
脂、１７……半導体素子搭載用リード端子、１８
……結線用リード端子、１９，２０，２１……デ
イスクリート部品搭載用リード端子、１７ａ，１
８ａ，１９ａ，２０ａ，２１ａ……一端、２３…
…デイスクリート部品本体、２３ａ，２３ｂ，２
３ｃ……側面。
FIG. 1 is a longitudinal side view of a resin-sealed power semiconductor device according to an embodiment of the present invention, FIG. 2 is a cross-sectional plan view thereof, and FIG. 3 is a longitudinal side view of a conventional resin-sealed semiconductor device. Similarly, FIG. 4 is a cross-sectional view thereof. 11...Lead frame, 12...Semiconductor element, 13...Photocoupler, 14...Solder, 15
... Bonding wire, 16 ... Insulating sealing resin, 17 ... Lead terminal for mounting semiconductor element, 18
... Lead terminal for wiring, 19, 20, 21 ... Lead terminal for mounting discrete components, 17a, 1
8a, 19a, 20a, 21a...one end, 23...
...Discrete parts body, 23a, 23b, 2
3c...side.
Claims (1)
ト部品が搭載され、これらが絶縁封脂樹脂にて封
止されて成る半導体装置において、前記リードフ
レームは、前記半導体素子が搭載される半導体素
子搭載用リード端子と、前記デイスクリート部品
が搭載される複数のデイスクリート部品搭載用リ
ード端子とを備え、前記デイスクリート部品の端
子は、デイスクリート部品本体の底面から突出し
ないように形成されたことを特徴とする半導体装
置。 In a semiconductor device in which a semiconductor element and a discrete component are mounted on a lead frame and these are sealed with an insulating sealing resin, the lead frame has a semiconductor element mounting lead terminal on which the semiconductor element is mounted, and , a plurality of discrete component mounting lead terminals on which the discrete component is mounted, and the terminal of the discrete component is formed so as not to protrude from the bottom surface of the discrete component body. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7841390U JPH0436251U (en) | 1990-07-23 | 1990-07-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7841390U JPH0436251U (en) | 1990-07-23 | 1990-07-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0436251U true JPH0436251U (en) | 1992-03-26 |
Family
ID=31621665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7841390U Pending JPH0436251U (en) | 1990-07-23 | 1990-07-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0436251U (en) |
-
1990
- 1990-07-23 JP JP7841390U patent/JPH0436251U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH01127251U (en) | ||
| JPH031540U (en) | ||
| JPH0436251U (en) | ||
| JPH0377461U (en) | ||
| JPS63187330U (en) | ||
| JPS63128745U (en) | ||
| JPH01135736U (en) | ||
| JPH0336141U (en) | ||
| JPS6176971U (en) | ||
| JPS6196547U (en) | ||
| JPS62140744U (en) | ||
| JPH0176040U (en) | ||
| JPH0245676U (en) | ||
| JPS59112954U (en) | Insulator-encapsulated semiconductor device | |
| JPH0474458U (en) | ||
| JPH01146531U (en) | ||
| JPH03116032U (en) | ||
| JPS61123544U (en) | ||
| JPS63174449U (en) | ||
| JPH0379442U (en) | ||
| JPS6312844U (en) | ||
| JPH0451145U (en) | ||
| JPS63115217U (en) | ||
| JPH0474461U (en) | ||
| JPS61100147U (en) |