JPS6430847U - - Google Patents
Info
- Publication number
- JPS6430847U JPS6430847U JP12654787U JP12654787U JPS6430847U JP S6430847 U JPS6430847 U JP S6430847U JP 12654787 U JP12654787 U JP 12654787U JP 12654787 U JP12654787 U JP 12654787U JP S6430847 U JPS6430847 U JP S6430847U
- Authority
- JP
- Japan
- Prior art keywords
- microwave
- board
- package
- substrate
- gold ribbon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 4
- 239000010931 gold Substances 0.000 claims description 4
- 229910052737 gold Inorganic materials 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
Landscapes
- Microwave Amplifiers (AREA)
Description
第１図はこの考案の一実施例を示すマイクロ波
ＩＣ基板の実装構造を示す平面図、第２図は第１
図の拡大断面図、第３図は従来のマイクロ波ＩＣ
基板の実装構造を示す平面図、第４図は第３図の
拡大断面図である。
図において、１はパツケージ、２は第２のマイ
クロ波ＩＣ基板、３はＲＦ端子、４は金リボン、
５はカバー、６はバイアス端子、７は不活性ガス
、８は第１のマイクロ波ＩＣ基板、９は第３のマ
イクロ波ＩＣ基板、ａはギヤツプ、ｂはａ＞なる
ギヤツプである。なお各図中同一符号は、同一ま
たは相当部分を示す。
FIG. 1 is a plan view showing the mounting structure of a microwave IC board showing an embodiment of this invention, and FIG.
An enlarged cross-sectional view of the figure, Figure 3 is a conventional microwave IC
FIG. 4 is a plan view showing the mounting structure of the board, and FIG. 4 is an enlarged sectional view of FIG. 3. In the figure, 1 is a package, 2 is a second microwave IC board, 3 is an RF terminal, 4 is a gold ribbon,
5 is a cover, 6 is a bias terminal, 7 is an inert gas, 8 is a first microwave IC board, 9 is a third microwave IC board, a is a gap, and b is a gap where a>. Note that the same reference numerals in each figure indicate the same or corresponding parts.
Claims (1)
ロ波ＩＣ基板、第２のマイクロ波ＩＣ基板、第３
のマイクロ波ＩＣ基板挿入し、上記外部リードと
第１のマイクロ波ＩＣ基板の一端が金リボンで接
続され、第１のマイクロ波ＩＣ基板の他端と、第
２のマイクロ波ＩＣ基板の一端、および第２のマ
イクロ波ＩＣ基板の他端と第３のマイクロ波ＩＣ
基板の一端が金リボンで接続され、かつ第３のマ
イクロ波ＩＣ基板の他端と外部リードが金リボン
で接続され、上記パツケージをカバーで覆い、パ
ツケージの中に不活性ガスを密封してあることを
特徴とするマイクロ波ＩＣ基板の実装構造。 A first microwave IC board, a second microwave IC board, and a third microwave IC board are placed in a package having external leads.
A microwave IC board is inserted, the external lead and one end of the first microwave IC board are connected with a gold ribbon, and the other end of the first microwave IC board and one end of the second microwave IC board are connected. and the other end of the second microwave IC substrate and the third microwave IC
One end of the substrate is connected with a gold ribbon, the other end of the third microwave IC substrate and an external lead are connected with a gold ribbon, the package is covered with a cover, and an inert gas is sealed inside the package. A mounting structure of a microwave IC board characterized by the following.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12654787U JPS6430847U (en) | 1987-08-20 | 1987-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12654787U JPS6430847U (en) | 1987-08-20 | 1987-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6430847U true JPS6430847U (en) | 1989-02-27 |
Family
ID=31378169
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12654787U Pending JPS6430847U (en) | 1987-08-20 | 1987-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6430847U (en) |
-
1987
- 1987-08-20 JP JP12654787U patent/JPS6430847U/ja active Pending
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