JPS6431448A - Lead frame and manufacture thereof - Google Patents

Lead frame and manufacture thereof

Info

Publication number
JPS6431448A
JPS6431448A JP62188625A JP18862587A JPS6431448A JP S6431448 A JPS6431448 A JP S6431448A JP 62188625 A JP62188625 A JP 62188625A JP 18862587 A JP18862587 A JP 18862587A JP S6431448 A JPS6431448 A JP S6431448A
Authority
JP
Japan
Prior art keywords
lead frame
partial plating
recess
boundary
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62188625A
Other languages
Japanese (ja)
Inventor
Takashi Suzumura
Hiromichi Yoshida
Tatsuya Otaka
Hiroyuki Kosaka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP62188625A priority Critical patent/JPS6431448A/en
Publication of JPS6431448A publication Critical patent/JPS6431448A/en
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE:To obtain a lead frame having a boundary position accuracy of a partial plating at leads by providing a recess on a boundary between the partial plating part and a nonplating part, and plating at least the partial plating part including a recess. CONSTITUTION:A lead frame 10 has a tab 8 for placing an IC element or the like, and leads 7 electrically connected by wire bonding to an IC element at the ends 9 of the leads and electrically connected to an external device via outer leads 11 of other end, a recess 2 provided on a boundary between a partial plating part 3 and a nonplating part, and at least the partial plating part including the recess 2 is plated. Accordingly, the step between the recess 2 formed by coining and the surface of the lead frame is positively utilized as the boundary between the partial plating part 3 and the nonplating part to obtain the lead frame having high partial plating position accuracy.
JP62188625A 1987-07-28 1987-07-28 Lead frame and manufacture thereof Pending JPS6431448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62188625A JPS6431448A (en) 1987-07-28 1987-07-28 Lead frame and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62188625A JPS6431448A (en) 1987-07-28 1987-07-28 Lead frame and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6431448A true JPS6431448A (en) 1989-02-01

Family

ID=16226962

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62188625A Pending JPS6431448A (en) 1987-07-28 1987-07-28 Lead frame and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6431448A (en)

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