JPS6457631A - Tape carrier tape and manufacture thereof - Google Patents

Tape carrier tape and manufacture thereof

Info

Publication number
JPS6457631A
JPS6457631A JP62212923A JP21292387A JPS6457631A JP S6457631 A JPS6457631 A JP S6457631A JP 62212923 A JP62212923 A JP 62212923A JP 21292387 A JP21292387 A JP 21292387A JP S6457631 A JPS6457631 A JP S6457631A
Authority
JP
Japan
Prior art keywords
tape
heat
device hole
resistant tape
conductive resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62212923A
Other languages
Japanese (ja)
Inventor
Yutaka Okuaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP62212923A priority Critical patent/JPS6457631A/en
Publication of JPS6457631A publication Critical patent/JPS6457631A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings

Landscapes

  • Wire Bonding (AREA)

Abstract

PURPOSE:To eliminate etching process, plating process and the like, and obtain a device excellent in yield, cost and reliability, by providing a heat-resistant tape having a device hole, and leads formed of conductive resin paste which protrude from above the heat-resistant tape into the device hole. CONSTITUTION:The title device is provided with a heat-resistant tape 21 having a device hole 21a whose dimension corresponds with the chip size, and leads 23 which is formed of conductive resin paste and arranged so as to protrude from the above the heat-resistant tape 21 into the device hole 21a aiming at its central part. A tape carrier tape is manufactured as follows. On the heat- resistant tape 21, a device hole 21a whose dimension corresponds with the chip size is formed, and stopped up with conductive resin paste. A semicured type conductive resin paste layer 22 having lead parts 22a extending in the form of a line on also the heat-resistant tape 21 is formed. Leads 23 which protrude from the lead part 22a into the device hole 21a aiming at its central part are formed from the above conductive paste layer 22.
JP62212923A 1987-08-28 1987-08-28 Tape carrier tape and manufacture thereof Pending JPS6457631A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62212923A JPS6457631A (en) 1987-08-28 1987-08-28 Tape carrier tape and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62212923A JPS6457631A (en) 1987-08-28 1987-08-28 Tape carrier tape and manufacture thereof

Publications (1)

Publication Number Publication Date
JPS6457631A true JPS6457631A (en) 1989-03-03

Family

ID=16630525

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62212923A Pending JPS6457631A (en) 1987-08-28 1987-08-28 Tape carrier tape and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS6457631A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017371A (en) * 2001-06-29 2003-01-17 Nippon Chemicon Corp Capacitor sealing structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003017371A (en) * 2001-06-29 2003-01-17 Nippon Chemicon Corp Capacitor sealing structure

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