JPS6431494A - Connecting structure of substrate equipped with microstrip line - Google Patents

Connecting structure of substrate equipped with microstrip line

Info

Publication number
JPS6431494A
JPS6431494A JP18844387A JP18844387A JPS6431494A JP S6431494 A JPS6431494 A JP S6431494A JP 18844387 A JP18844387 A JP 18844387A JP 18844387 A JP18844387 A JP 18844387A JP S6431494 A JPS6431494 A JP S6431494A
Authority
JP
Japan
Prior art keywords
pattern
superposed
dielectric substrate
microstrip line
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18844387A
Other languages
Japanese (ja)
Inventor
Naoki Okamoto
Masao Miyazaki
Tomozo Ota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP18844387A priority Critical patent/JPS6431494A/en
Publication of JPS6431494A publication Critical patent/JPS6431494A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To assure uniform connection for improvement of workability by connecting a strip pattern with a back pattern via a through-hole, and further connecting by soldering the back pattern with a microstrip pattern formed on the upper surface of a dielectric substrate equipped with a microstrip line. CONSTITUTION:Two dielectric substrates 7, 8 are superposed, and a base pattern 16 of the dielectric substrate 7 and part of a strip pattern 12 of the dielectric substrate 8 are superposed. A part of the back conductor 9 which is superposed on the strip pattern 12 is removed for preventing any short circuiting. Here, the back conductors 9, 10 are connected with a common ground casing 14, for the same grounding. A solder 13 is melted upon soldering, allowed to flow into the through-hole 15, and reaches the back pattern 16 fop solidification. The use of fluidity of the molten solder assures a constant soldered area as well as very reproducible connection.
JP18844387A 1987-07-28 1987-07-28 Connecting structure of substrate equipped with microstrip line Pending JPS6431494A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18844387A JPS6431494A (en) 1987-07-28 1987-07-28 Connecting structure of substrate equipped with microstrip line

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18844387A JPS6431494A (en) 1987-07-28 1987-07-28 Connecting structure of substrate equipped with microstrip line

Publications (1)

Publication Number Publication Date
JPS6431494A true JPS6431494A (en) 1989-02-01

Family

ID=16223773

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18844387A Pending JPS6431494A (en) 1987-07-28 1987-07-28 Connecting structure of substrate equipped with microstrip line

Country Status (1)

Country Link
JP (1) JPS6431494A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6710672B2 (en) 1999-11-30 2004-03-23 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device, communication apparatus, and method for manufacturing nonreciprocal circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6710672B2 (en) 1999-11-30 2004-03-23 Murata Manufacturing Co., Ltd. Nonreciprocal circuit device, communication apparatus, and method for manufacturing nonreciprocal circuit device

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