JPS646385A - Electrical connection structure of circuit substrates - Google Patents

Electrical connection structure of circuit substrates

Info

Publication number
JPS646385A
JPS646385A JP62159469A JP15946987A JPS646385A JP S646385 A JPS646385 A JP S646385A JP 62159469 A JP62159469 A JP 62159469A JP 15946987 A JP15946987 A JP 15946987A JP S646385 A JPS646385 A JP S646385A
Authority
JP
Japan
Prior art keywords
hole
land
circuit substrates
center
electrical connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62159469A
Other languages
Japanese (ja)
Inventor
Toshiya Kurihashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP62159469A priority Critical patent/JPS646385A/en
Publication of JPS646385A publication Critical patent/JPS646385A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Multi-Conductor Connections (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To prevent a poor connection by connecting the first and the second circuit substrates electrically with the solder pouring into a through hole on condition that the center of the through hole and the center of a land are positioned being slipped out relatively. CONSTITUTION:A through hole 13 and a land 14 are formed on circuit substrates 11 and 12 respectively to make the center line O1 of the through hole 13 formed on the one side circuit substrate 11 and the center line O2 of the land 14 formed on the other side circuit substrate 12 slipped out a little each other. Therefore, a minute clearance 8 owing to the difference in level of the land 14 and an insulator 6 is formed linking to the space in the through hole 13. As a result, not only when the solder 5 is poured without filling fully in the through hole 13, but also filling it fully in the through hole 13, the air in the through hole 13 has the escape room, and a soldering connection including no bubble can be carried out. In such a way, plural circuit substrates can be connected electrically with generating no defect.
JP62159469A 1987-06-26 1987-06-26 Electrical connection structure of circuit substrates Pending JPS646385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62159469A JPS646385A (en) 1987-06-26 1987-06-26 Electrical connection structure of circuit substrates

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62159469A JPS646385A (en) 1987-06-26 1987-06-26 Electrical connection structure of circuit substrates

Publications (1)

Publication Number Publication Date
JPS646385A true JPS646385A (en) 1989-01-10

Family

ID=15694451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62159469A Pending JPS646385A (en) 1987-06-26 1987-06-26 Electrical connection structure of circuit substrates

Country Status (1)

Country Link
JP (1) JPS646385A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537111A (en) * 1991-07-31 1993-02-12 Marantz Japan Inc Mounting structure of hybrid ic
GB2291070A (en) * 1994-07-14 1996-01-17 Permelec Electrode Ltd Fixing electrode to electrode substrate by welding metal filled in a plurality of holes in the electrode to the electrode and the substrate
WO1999004453A1 (en) * 1997-07-16 1999-01-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Contact and method for producing a contact
US7207837B2 (en) 2005-08-22 2007-04-24 Sumitomo Wiring Systems, Ltd. Connector and a mounting method therefor
JP2008223526A (en) * 2007-03-09 2008-09-25 Calsonic Compressor Inc Gas compressor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0537111A (en) * 1991-07-31 1993-02-12 Marantz Japan Inc Mounting structure of hybrid ic
GB2291070A (en) * 1994-07-14 1996-01-17 Permelec Electrode Ltd Fixing electrode to electrode substrate by welding metal filled in a plurality of holes in the electrode to the electrode and the substrate
WO1999004453A1 (en) * 1997-07-16 1999-01-28 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Contact and method for producing a contact
US7207837B2 (en) 2005-08-22 2007-04-24 Sumitomo Wiring Systems, Ltd. Connector and a mounting method therefor
JP2008223526A (en) * 2007-03-09 2008-09-25 Calsonic Compressor Inc Gas compressor

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