JPS6433079A - Process for bonding sintered body of cubic boron nitride - Google Patents
Process for bonding sintered body of cubic boron nitrideInfo
- Publication number
- JPS6433079A JPS6433079A JP18964987A JP18964987A JPS6433079A JP S6433079 A JPS6433079 A JP S6433079A JP 18964987 A JP18964987 A JP 18964987A JP 18964987 A JP18964987 A JP 18964987A JP S6433079 A JPS6433079 A JP S6433079A
- Authority
- JP
- Japan
- Prior art keywords
- sintered bodies
- foil
- pure
- film
- cubic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title abstract 2
- 229910052582 BN Inorganic materials 0.000 title 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 title 1
- 239000011888 foil Substances 0.000 abstract 4
- 229910018507 Al—Ni Inorganic materials 0.000 abstract 3
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011261 inert gas Substances 0.000 abstract 1
- 238000007733 ion plating Methods 0.000 abstract 1
- 238000004544 sputter deposition Methods 0.000 abstract 1
Landscapes
- Ceramic Products (AREA)
Abstract
PURPOSE:To bond sintered bodies of cubic BN to each other extremely firmly by inserting a sheet of pure Al foil or pure Al-Ni foil between a pair of cubic BN sintered bodies having a Ti film and an Ni film formed successively on each bonding face, and heating at a specified temp. in nonoxidizing atmosphere. CONSTITUTION:A Ti film having 0.01-1mum thickness and an Ni film having 0.01-1mum thickness are formed successively on a bonding face of a pair of cubic BN (cBN) sintered bodies by a sputtering method, or ion plating method, etc. Then, a pure Al foil or an Al-Ni alloy contg. >=90wt.% Al and residual wt.% Ni, having 10-1000mum thickness is inserted between bonding faces of said cBN sintered bodies. Then, said cBN sintered bodies contg. the pure Al foil, etc., are heated at a temp. within a range from above the m.p. of Al or Al-Ni alloy to below 750 deg.C in inert gas atmosphere. By this process, cBN sintered bodies are bonded extremely firmly to each other even at a low temp. below or above 750 deg.C.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18964987A JPS6433079A (en) | 1987-07-29 | 1987-07-29 | Process for bonding sintered body of cubic boron nitride |
| DE8888112070T DE3868451D1 (en) | 1987-07-29 | 1988-07-26 | METHOD FOR CONNECTING A SINTER BODY OF CUBIC BORNITRIDE. |
| EP19880112070 EP0301492B1 (en) | 1987-07-29 | 1988-07-26 | Method for bonding cubic boron nitride sintered compact |
| US07/224,930 US4859531A (en) | 1987-07-29 | 1988-07-27 | Method for bonding a cubic boron nitride sintered compact |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18964987A JPS6433079A (en) | 1987-07-29 | 1987-07-29 | Process for bonding sintered body of cubic boron nitride |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6433079A true JPS6433079A (en) | 1989-02-02 |
Family
ID=16244850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18964987A Pending JPS6433079A (en) | 1987-07-29 | 1987-07-29 | Process for bonding sintered body of cubic boron nitride |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6433079A (en) |
-
1987
- 1987-07-29 JP JP18964987A patent/JPS6433079A/en active Pending
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