JPS6433366U - - Google Patents
Info
- Publication number
- JPS6433366U JPS6433366U JP12726287U JP12726287U JPS6433366U JP S6433366 U JPS6433366 U JP S6433366U JP 12726287 U JP12726287 U JP 12726287U JP 12726287 U JP12726287 U JP 12726287U JP S6433366 U JPS6433366 U JP S6433366U
- Authority
- JP
- Japan
- Prior art keywords
- jet
- solder
- soldering
- nozzle
- soldering device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 10
- 238000005476 soldering Methods 0.000 claims 5
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は要部の斜視図、第２図は同上縦断側面
図、第３図は別実施例の要部の断面図、第４図は
一般的なシヤーシーの平面図、第５図は同上正面
図、第６図は同上側面図である。
１……半田槽、２……第１波半田噴出ノズル、
３……第２波半田噴出ノズル、４……半田噴出ダ
クト、４ａ，４ｂ……側壁、５……壁板、５ａ，
５ｂ……スリツト、６……半田噴出ダクト、６ａ
……進入側側壁、７……壁板、７ａ……誘導壁部
、７ｂ……スリツト、８……壁板、８ａ……スリ
ツト、９……トレー、１０ａ，１０ｂ……ノズル
壁、１１……スリツト。
Figure 1 is a perspective view of the main parts, Figure 2 is a vertical side view of the same as above, Figure 3 is a sectional view of the main parts of another embodiment, Figure 4 is a plan view of a general chassis, and Figure 5 is the same as above. The front view and FIG. 6 are side views of the same. 1... Solder tank, 2... First wave solder jet nozzle,
3... Second wave solder ejection nozzle, 4... Solder ejection duct, 4a, 4b... Side wall, 5... Wall plate, 5a,
5b...Slit, 6...Solder spout duct, 6a
...Entry side wall, 7...Wall plate, 7a...Guiding wall portion, 7b...Slit, 8...Wall plate, 8a...Slit, 9...Tray, 10a, 10b...Nozzle wall, 11... ...Slit.
Claims (1)
、プリント基板などの被半田付け物を、半田噴出
ノズルから噴流される半田に接触させながら搬送
し、電子部品の半田付けを行うようにした噴流式
半田付装置において、上記半田噴出ノズルを構成
する進入側、および、進出側の壁板上部に、上記
被半田付け物の下向き突起物が通過するスリツチ
を対称的に設けたことを特徴とする噴流式半田付
装置。 (2) スリツトをもつ壁板を、半田噴流ダクトに
対して着脱変換可能とした実用新案登録請求の範
囲第１項記載の噴流式半田付装置。 (3) スリツトをもつ専用半田噴出ノズルとした
実用新案登録請求の範囲第１項記載の噴流式半田
付装置。[Scope of Claim for Utility Model Registration] (1) Soldering of electronic components by transporting an object to be soldered, such as a chassis with electronic components attached or a printed circuit board, in contact with solder jetted from a solder jet nozzle. In the jet type soldering apparatus, slits through which the downward protrusions of the objects to be soldered pass are symmetrically provided at the upper part of the wall plates on the entrance side and the exit side that constitute the solder jetting nozzle. A jet soldering device characterized by: (2) The jet soldering device according to claim 1, which is a utility model, in which a wall plate having slits can be attached to and removed from a solder jet duct. (3) The jet soldering device according to claim 1, which is a dedicated solder jet nozzle having a slit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12726287U JPS6433366U (en) | 1987-08-20 | 1987-08-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12726287U JPS6433366U (en) | 1987-08-20 | 1987-08-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6433366U true JPS6433366U (en) | 1989-03-01 |
Family
ID=31379532
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12726287U Pending JPS6433366U (en) | 1987-08-20 | 1987-08-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6433366U (en) |
-
1987
- 1987-08-20 JP JP12726287U patent/JPS6433366U/ja active Pending
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