JPS6433751U - - Google Patents
Info
- Publication number
- JPS6433751U JPS6433751U JP1987129387U JP12938787U JPS6433751U JP S6433751 U JPS6433751 U JP S6433751U JP 1987129387 U JP1987129387 U JP 1987129387U JP 12938787 U JP12938787 U JP 12938787U JP S6433751 U JPS6433751 U JP S6433751U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- resin
- sealed
- leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/0198—Manufacture or treatment batch processes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987129387U JPS6433751U (cs) | 1987-08-25 | 1987-08-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987129387U JPS6433751U (cs) | 1987-08-25 | 1987-08-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6433751U true JPS6433751U (cs) | 1989-03-02 |
Family
ID=31383615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987129387U Pending JPS6433751U (cs) | 1987-08-25 | 1987-08-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6433751U (cs) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037362A (cs) * | 1973-08-06 | 1975-04-08 | ||
| JPS6450454A (en) * | 1987-08-21 | 1989-02-27 | Hitachi Ltd | Manufacture of lead frame and semiconductor device |
-
1987
- 1987-08-25 JP JP1987129387U patent/JPS6433751U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5037362A (cs) * | 1973-08-06 | 1975-04-08 | ||
| JPS6450454A (en) * | 1987-08-21 | 1989-02-27 | Hitachi Ltd | Manufacture of lead frame and semiconductor device |