JPS6433939A - Resin sealed type semiconductor device - Google Patents

Resin sealed type semiconductor device

Info

Publication number
JPS6433939A
JPS6433939A JP62191100A JP19110087A JPS6433939A JP S6433939 A JPS6433939 A JP S6433939A JP 62191100 A JP62191100 A JP 62191100A JP 19110087 A JP19110087 A JP 19110087A JP S6433939 A JPS6433939 A JP S6433939A
Authority
JP
Japan
Prior art keywords
insulator
resin
semiconductor element
bonding agent
inner leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62191100A
Other languages
Japanese (ja)
Inventor
Masaji Ogata
Hiroyuki Hozoji
Hidetoshi Abe
Masanori Segawa
Shigeo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP62191100A priority Critical patent/JPS6433939A/en
Publication of JPS6433939A publication Critical patent/JPS6433939A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To obtain a package structure characterized by excellent moisture resistance reliability, solder moisture resistance and to crack resistance, by providing an insulator comprising a thermoplastic-resin bonding agent or a thermosetting-resin bonding agent, in which organic filler having a specified grain diameter is compounded, and junctioning the facing surfaces of a semiconductor element and inner leads with said insulator. CONSTITUTION:A semiconductor element 1 is mounted on inner leads 2 of a lead frame through an insulator 5. Said semiconductor element 1 and the inner leads 2 are connected through bonding wires 3. The entire body is sealed with a thermosetting- resin based molding material 4. In this resin sealed type semiconductor device, said insulator 5 comprises a thermoplastic-resin bonding agent or a thermosetting-resin bonding agent, in which an inorganic filler or an organic filler having a specified grain diameter is compounded. The facing surfaces of the semiconductor element 1 and the inner leads 2 are junctioned with said insulator 5. For example, as said filler, a material, which is obtained by fusing fine powder of glass and the like in high temperature flames and forming a spherical form with surface tension, is used. As the organic filler, spherical fine powder of epoxy resin, which is obtained by suspension polymerization is used.
JP62191100A 1987-07-29 1987-07-29 Resin sealed type semiconductor device Pending JPS6433939A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62191100A JPS6433939A (en) 1987-07-29 1987-07-29 Resin sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62191100A JPS6433939A (en) 1987-07-29 1987-07-29 Resin sealed type semiconductor device

Publications (1)

Publication Number Publication Date
JPS6433939A true JPS6433939A (en) 1989-02-03

Family

ID=16268855

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62191100A Pending JPS6433939A (en) 1987-07-29 1987-07-29 Resin sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS6433939A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5541446A (en) * 1994-08-29 1996-07-30 Analog Devices, Inc. Integrated circuit package with improved heat dissipation
WO2000048714A1 (en) * 1999-02-18 2000-08-24 Yasuo Fukutani Purificating agent for flue gas and incinerated ash and purificating method using the same
WO2008136818A2 (en) 2006-12-21 2008-11-13 E. I. Du Pont De Nemours And Company Suspensions of titanium (iv) oxide particles and process for their production

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61218139A (en) * 1985-03-25 1986-09-27 Hitachi Chiyou Lsi Eng Kk Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61218139A (en) * 1985-03-25 1986-09-27 Hitachi Chiyou Lsi Eng Kk Semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5541446A (en) * 1994-08-29 1996-07-30 Analog Devices, Inc. Integrated circuit package with improved heat dissipation
WO2000048714A1 (en) * 1999-02-18 2000-08-24 Yasuo Fukutani Purificating agent for flue gas and incinerated ash and purificating method using the same
WO2008136818A2 (en) 2006-12-21 2008-11-13 E. I. Du Pont De Nemours And Company Suspensions of titanium (iv) oxide particles and process for their production

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