JPS6435794U - - Google Patents
Info
- Publication number
- JPS6435794U JPS6435794U JP1987129483U JP12948387U JPS6435794U JP S6435794 U JPS6435794 U JP S6435794U JP 1987129483 U JP1987129483 U JP 1987129483U JP 12948387 U JP12948387 U JP 12948387U JP S6435794 U JPS6435794 U JP S6435794U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- cooling plate
- flange portion
- ring
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/877—Bump connectors and die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
- H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Description
第１図は本考案の原理説明図、第２図は本考案
による一実施例の側面断面図、第３図は従来の説
明図で、ａは斜視図、ｂは側面断面図を示す。 図において、１は冷却プレート、２は冷却素子
、３はフランジ部、４は冷媒、５はＯリング、６
は樹脂リング、２Ａは内部を示す。
による一実施例の側面断面図、第３図は従来の説
明図で、ａは斜視図、ｂは側面断面図を示す。 図において、１は冷却プレート、２は冷却素子
、３はフランジ部、４は冷媒、５はＯリング、６
は樹脂リング、２Ａは内部を示す。
Claims (1)
- 【実用新案登録請求の範囲】 冷媒４が循環される冷却プレート１と、該冷却
プレート１の所定箇所にフランジ部３を係止する
ことで固着される冷却素子２とを備え、該冷媒４
が該冷却プレート１より該冷却素子２の内部２Ａ
に流通される冷却構造において、 合成樹脂材によつて形成される樹脂リング６が
前記冷却プレート１と前記フランジ部３とのいづ
れかの一方に固着されることで設けられ、かつ、
該樹脂リング６を介在することで該冷却プレート
１と該フランジ部３との当接部７を密封させるＯ
リング５が設けられて成ることを特徴とする冷却
構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987129483U JPH0530394Y2 (ja) | 1987-08-26 | 1987-08-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987129483U JPH0530394Y2 (ja) | 1987-08-26 | 1987-08-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6435794U true JPS6435794U (ja) | 1989-03-03 |
| JPH0530394Y2 JPH0530394Y2 (ja) | 1993-08-03 |
Family
ID=31383799
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987129483U Expired - Lifetime JPH0530394Y2 (ja) | 1987-08-26 | 1987-08-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0530394Y2 (ja) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737258U (ja) * | 1980-08-11 | 1982-02-27 | ||
| JPS6267844A (ja) * | 1985-09-20 | 1987-03-27 | Fujitsu Ltd | 冷却構造 |
-
1987
- 1987-08-26 JP JP1987129483U patent/JPH0530394Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737258U (ja) * | 1980-08-11 | 1982-02-27 | ||
| JPS6267844A (ja) * | 1985-09-20 | 1987-03-27 | Fujitsu Ltd | 冷却構造 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0530394Y2 (ja) | 1993-08-03 |