JPS6436084A - Thin film photosensor - Google Patents

Thin film photosensor

Info

Publication number
JPS6436084A
JPS6436084A JP62191986A JP19198687A JPS6436084A JP S6436084 A JPS6436084 A JP S6436084A JP 62191986 A JP62191986 A JP 62191986A JP 19198687 A JP19198687 A JP 19198687A JP S6436084 A JPS6436084 A JP S6436084A
Authority
JP
Japan
Prior art keywords
conductive paste
throughholes
substrate
throughhole
takes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62191986A
Other languages
Japanese (ja)
Inventor
Michio Osawa
Takashi Arita
Akira Hanabusa
Yasuhiro Saito
Masaharu Ono
Koshiro Mori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62191986A priority Critical patent/JPS6436084A/en
Publication of JPS6436084A publication Critical patent/JPS6436084A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H05K3/445—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits having insulated holes or insulated via connections through the metal core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

Landscapes

  • Photovoltaic Devices (AREA)

Abstract

PURPOSE:To make it possible to reduce the series resistance even if the substrate is thick in the case of small throughholes, by providing throughholes in a part of a substrate having a photovoltaic cell formed on one surface thereof, applying a conductive paste on the inside of the throughholes and part of the other surface of the substrate, and connecting electronic parts to the circuit pattern formed on the other surface of the substrate with the conductive paste, thereby forming an electric circuit. CONSTITUTION:On the rear side B of a metallic substrate 1 having a conductive layer 11 formed on the inner surface of throughholes 9a, 9b, a conductive paste is applied by a screen printing method, thereby forming pads 12a, 12b for lead wire connection and circuit patterns 13a, 13b. At this time, a conductive paste 14 is caused to encroach into the throughholes 9a, 9b by the pressure of the squeegee, and the conductive paste 14 in the throughhole 9a takes an electrical contact of a lower electrode 3 in a region I with the pad 12a for lead wire connection. The conductive paste 14 in the throughhole 9b takes an electrical contact with a transparent electrode 5 in a region IV.
JP62191986A 1987-07-31 1987-07-31 Thin film photosensor Pending JPS6436084A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62191986A JPS6436084A (en) 1987-07-31 1987-07-31 Thin film photosensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62191986A JPS6436084A (en) 1987-07-31 1987-07-31 Thin film photosensor

Publications (1)

Publication Number Publication Date
JPS6436084A true JPS6436084A (en) 1989-02-07

Family

ID=16283727

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62191986A Pending JPS6436084A (en) 1987-07-31 1987-07-31 Thin film photosensor

Country Status (1)

Country Link
JP (1) JPS6436084A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1093119A (en) * 1996-09-13 1998-04-10 Sanyo Electric Co Ltd Method of manufacturing substrate for photovoltaic device and photovoltaic device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1093119A (en) * 1996-09-13 1998-04-10 Sanyo Electric Co Ltd Method of manufacturing substrate for photovoltaic device and photovoltaic device

Similar Documents

Publication Publication Date Title
TW342580B (en) Printed circuit assembly and method of manufacture therefor
JPS5745955A (en) Sealing container
MY126682A (en) Electrode package having embedded capacitors and method of fabrication therefor
GB2341277A (en) An electronic component package with posts on the active surface
TW498188B (en) Laminated substrate and data input device using the same
MY110786A (en) Method for producing a printed circuit board and a printed circuit board
US5112648A (en) Method of manufacturing a printed circuit board
JPS6411357A (en) Method of taking out lead of semiconductor chip component
US20020184759A1 (en) Process for producing a contact-making device
JPS6436084A (en) Thin film photosensor
JPS5618448A (en) Composite electronic part
GB939394A (en) Improved metal-supported electric circuit arrays
EP0138673A3 (en) Method of making a printed circuit board
EP0242020A3 (en) Electrical circuits
JPS6486527A (en) Ccb tape carrier
JPS575356A (en) Hybrid integrated circuit device
JPS6453493A (en) Wiring board for surface packaging
CA2055148A1 (en) Method of forming an electrically conductive contact on a substrate
JPS5575257A (en) Substrate circuit device
EP0393979A3 (en) Method for manufacturing edge end emission type electroluminescent device arrays
JPS6457795A (en) Manufacture of thick film circuit device
JPS57108263A (en) Producing device for thin film pattern
JPS6233230Y2 (en)
Avellino et al. Printed Circuit Assembly With Contact Dot
JPS6418211A (en) Chip electronic component