JPS6457795A - Manufacture of thick film circuit device - Google Patents
Manufacture of thick film circuit deviceInfo
- Publication number
- JPS6457795A JPS6457795A JP21437487A JP21437487A JPS6457795A JP S6457795 A JPS6457795 A JP S6457795A JP 21437487 A JP21437487 A JP 21437487A JP 21437487 A JP21437487 A JP 21437487A JP S6457795 A JPS6457795 A JP S6457795A
- Authority
- JP
- Japan
- Prior art keywords
- crossover
- region
- land
- printed
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000005476 soldering Methods 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 1
- 239000011521 glass Substances 0.000 abstract 1
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000000758 substrate Substances 0.000 abstract 1
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
PURPOSE:To accurately form a crossover insulating layer on the periphery of a soldering electrode land by forming an insulating layer simultaneously with a crossover region on the peripheral region near at least the crossover region of a soldering electrode land which is disposed near at least the crossover region. CONSTITUTION:First crossover glass paste is printed on a crossover region 4 and the part of the periphery of a soldering electrode land 3, dried and baked to form a first crossover insulating layer 5. Part of a first wiring conductor film 2 is covered with the layer 5 and the periphery of the region near the crossover region 4 of the land 3 is also covered therewith. Accordingly, it operates as the function of a solder resist layer. When the paste for forming the layer 5 is printed, the rugged part of the region near the land 3 is small. Thus, squeegee is in close contact with a substrate 1, and an accurate pattern is printed with less sag to prevent the paste from adhering to the land 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62214374A JPH0824215B2 (en) | 1987-08-28 | 1987-08-28 | Method for manufacturing thick film circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62214374A JPH0824215B2 (en) | 1987-08-28 | 1987-08-28 | Method for manufacturing thick film circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6457795A true JPS6457795A (en) | 1989-03-06 |
| JPH0824215B2 JPH0824215B2 (en) | 1996-03-06 |
Family
ID=16654729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62214374A Expired - Lifetime JPH0824215B2 (en) | 1987-08-28 | 1987-08-28 | Method for manufacturing thick film circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0824215B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2170026A1 (en) | 2002-06-20 | 2010-03-31 | Curamik Electronics GmbH | Metal ceramic substrate for electric components or modules, method for producing such a substrate and module with such a substrate |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50117365U (en) * | 1974-03-13 | 1975-09-25 | ||
| JPS51149558A (en) * | 1975-06-17 | 1976-12-22 | Tokyo Shibaura Electric Co | Multilayered printed board |
| JPS56132778U (en) * | 1980-03-07 | 1981-10-08 | ||
| JPS61110490A (en) * | 1984-11-02 | 1986-05-28 | 松下電器産業株式会社 | Method of forming resist film on printed circuit board |
-
1987
- 1987-08-28 JP JP62214374A patent/JPH0824215B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50117365U (en) * | 1974-03-13 | 1975-09-25 | ||
| JPS51149558A (en) * | 1975-06-17 | 1976-12-22 | Tokyo Shibaura Electric Co | Multilayered printed board |
| JPS56132778U (en) * | 1980-03-07 | 1981-10-08 | ||
| JPS61110490A (en) * | 1984-11-02 | 1986-05-28 | 松下電器産業株式会社 | Method of forming resist film on printed circuit board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2170026A1 (en) | 2002-06-20 | 2010-03-31 | Curamik Electronics GmbH | Metal ceramic substrate for electric components or modules, method for producing such a substrate and module with such a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0824215B2 (en) | 1996-03-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080306 Year of fee payment: 12 |