JPS6437043A - Resin-sealed semiconductor device - Google Patents

Resin-sealed semiconductor device

Info

Publication number
JPS6437043A
JPS6437043A JP19283287A JP19283287A JPS6437043A JP S6437043 A JPS6437043 A JP S6437043A JP 19283287 A JP19283287 A JP 19283287A JP 19283287 A JP19283287 A JP 19283287A JP S6437043 A JPS6437043 A JP S6437043A
Authority
JP
Japan
Prior art keywords
lead
resin body
metal layer
resin
covering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19283287A
Other languages
Japanese (ja)
Other versions
JPH0567069B2 (en
Inventor
Sukeyuki Kami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP19283287A priority Critical patent/JPS6437043A/en
Publication of JPS6437043A publication Critical patent/JPS6437043A/en
Publication of JPH0567069B2 publication Critical patent/JPH0567069B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve a device in resistance to humidity by a method wherein a metal layer, covering the surface of a first resin body except a spot for a lead to come out, and a second resin body, covering the surface including the metal layer, are provided. CONSTITUTION:A device of this design is constructed of a semiconductor chip 2 installed on an island 1 on a leadframe, a bonding line 4 that connects an electrode of the semiconductor chip 2 and the inner end of a lead 3 of the lead frame, a first resin body 5 providing a seal on the island 1 and the inner end of the lead 3, a metal layer 7 covering the surface except a spot where the lead 3 comes out of the surface of the first resin body 5, and a second resin body 8 providing a seal on the surface including the metal layer 7. This design prevents water from penetrating in through the resin surface, which enhances the reliability of a semiconductor device.
JP19283287A 1987-07-31 1987-07-31 Resin-sealed semiconductor device Granted JPS6437043A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19283287A JPS6437043A (en) 1987-07-31 1987-07-31 Resin-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19283287A JPS6437043A (en) 1987-07-31 1987-07-31 Resin-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS6437043A true JPS6437043A (en) 1989-02-07
JPH0567069B2 JPH0567069B2 (en) 1993-09-24

Family

ID=16297720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19283287A Granted JPS6437043A (en) 1987-07-31 1987-07-31 Resin-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS6437043A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600181A (en) * 1995-05-24 1997-02-04 Lockheed Martin Corporation Hermetically sealed high density multi-chip package
US6535392B2 (en) 2000-08-11 2003-03-18 Denso Corporation Voltage control apparatus for vehicle AC generator
US9070793B2 (en) 2010-08-02 2015-06-30 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having electromagnetic interference shielding and related methods
WO2016067930A1 (en) * 2014-10-29 2016-05-06 日立オートモティブシステムズ株式会社 Electronic device and method for manufacturing electronic device

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165664U (en) * 1974-11-15 1976-05-24
JPS5972748A (en) * 1982-10-20 1984-04-24 Nec Kyushu Ltd Semiconductor device
JPS59151446U (en) * 1983-03-30 1984-10-11 株式会社東芝 semiconductor equipment

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5165664U (en) * 1974-11-15 1976-05-24
JPS5972748A (en) * 1982-10-20 1984-04-24 Nec Kyushu Ltd Semiconductor device
JPS59151446U (en) * 1983-03-30 1984-10-11 株式会社東芝 semiconductor equipment

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5600181A (en) * 1995-05-24 1997-02-04 Lockheed Martin Corporation Hermetically sealed high density multi-chip package
US6535392B2 (en) 2000-08-11 2003-03-18 Denso Corporation Voltage control apparatus for vehicle AC generator
US9070793B2 (en) 2010-08-02 2015-06-30 Advanced Semiconductor Engineering, Inc. Semiconductor device packages having electromagnetic interference shielding and related methods
WO2016067930A1 (en) * 2014-10-29 2016-05-06 日立オートモティブシステムズ株式会社 Electronic device and method for manufacturing electronic device
JPWO2016067930A1 (en) * 2014-10-29 2017-07-27 日立オートモティブシステムズ株式会社 Electronic device and method for manufacturing electronic device
CN107078100A (en) * 2014-10-29 2017-08-18 日立汽车系统株式会社 Electronic device and method for manufacturing electronic device
US10128164B2 (en) 2014-10-29 2018-11-13 Hitachi Automotive Systems, Ltd. Electronic device and method of manufacturing the electronic device
CN107078100B (en) * 2014-10-29 2019-04-23 日立汽车系统株式会社 Electronic device and manufacturing method of electronic device

Also Published As

Publication number Publication date
JPH0567069B2 (en) 1993-09-24

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