JPS6437076U - - Google Patents
Info
- Publication number
- JPS6437076U JPS6437076U JP13246087U JP13246087U JPS6437076U JP S6437076 U JPS6437076 U JP S6437076U JP 13246087 U JP13246087 U JP 13246087U JP 13246087 U JP13246087 U JP 13246087U JP S6437076 U JPS6437076 U JP S6437076U
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- substrate
- printed circuit
- hole
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 8
- 239000000758 substrate Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は本考案の一実施例に係る混成集積回路
の断面図、第２図は従来の混成集積回路の断面図
、第３図は従来の改善された混成集積回路の説明
図、第４図は本考案の混成集積回路の貫通穴部分
での改良例の説明図である。
１……絶縁性基板、２……貫通穴、３ａ〜３ｅ
……導体層、４ａ，４ｂ……ランド、６……半導
体素子、８，９……抵抗、２１……導電体、２１
ａ……棒状の絶縁体、２１ｂ……筒状導電体、３
１……棒状導体。
FIG. 1 is a cross-sectional view of a hybrid integrated circuit according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of a conventional hybrid integrated circuit, FIG. 3 is an explanatory diagram of a conventional improved hybrid integrated circuit, and FIG. The figure is an explanatory diagram of an improved example of the through-hole portion of the hybrid integrated circuit of the present invention. 1...Insulating substrate, 2...Through hole, 3a to 3e
...Conductor layer, 4a, 4b... Land, 6... Semiconductor element, 8, 9... Resistor, 21... Conductor, 21
a... Rod-shaped insulator, 21b... Cylindrical conductor, 3
1... Rod-shaped conductor.
Claims (1)
の基板を貫通する貫通穴と、この貫通穴に挿通さ
れ前記基板と同材料を主成分とする筒状又は棒状
の導電体と、前記印刷回路と導電体とを電気的に
接続する導体とを具備することを特徴とする混成
集積回路。 An insulating substrate with a printed circuit formed on both sides, a through hole penetrating the substrate, a cylindrical or rod-shaped conductor inserted into the through hole and mainly made of the same material as the substrate, and the printed circuit. 1. A hybrid integrated circuit comprising: a conductor that electrically connects the conductor and the conductor;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13246087U JPS6437076U (en) | 1987-08-31 | 1987-08-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13246087U JPS6437076U (en) | 1987-08-31 | 1987-08-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6437076U true JPS6437076U (en) | 1989-03-06 |
Family
ID=31389439
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13246087U Pending JPS6437076U (en) | 1987-08-31 | 1987-08-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6437076U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757572A (en) * | 1980-09-22 | 1982-04-06 | Akiyoshi Kinoshita | Game device |
| JPS62208691A (en) * | 1986-03-10 | 1987-09-12 | 株式会社日立製作所 | Double-sided hybrid integrated circuit |
-
1987
- 1987-08-31 JP JP13246087U patent/JPS6437076U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5757572A (en) * | 1980-09-22 | 1982-04-06 | Akiyoshi Kinoshita | Game device |
| JPS62208691A (en) * | 1986-03-10 | 1987-09-12 | 株式会社日立製作所 | Double-sided hybrid integrated circuit |