JPH0284367U - - Google Patents
Info
- Publication number
- JPH0284367U JPH0284367U JP16480688U JP16480688U JPH0284367U JP H0284367 U JPH0284367 U JP H0284367U JP 16480688 U JP16480688 U JP 16480688U JP 16480688 U JP16480688 U JP 16480688U JP H0284367 U JPH0284367 U JP H0284367U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- substrate
- thick film
- electrode
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005476 soldering Methods 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 3
- 239000011810 insulating material Substances 0.000 claims 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図乃至第３図は、この考案のスルーホール
配線基板のスルーホール電極形成順序を示す要部
拡大縦断面図、第４図は従来のスルーホール配線
基板のスルーホール部の拡大縦断面図である。
１１……配線基板、１２……穴、１３……閉鎖
部、１４……電極、１５……スルーホール電極、
１６……半田付けランド。
1 to 3 are enlarged vertical cross-sectional views of main parts showing the order of forming through-hole electrodes of the through-hole wiring board of this invention, and FIG. 4 is an enlarged vertical cross-sectional view of the through-hole portion of the conventional through-hole wiring board. It is. 11... Wiring board, 12... Hole, 13... Closed part, 14... Electrode, 15... Through-hole electrode,
16...Soldering land.
Claims (1)
穴を設け、この基板の一方の面に厚膜電極を形成
すると共に、該穴にスルーホール電極を形成する
際に基板の他方側において穴を詰まらせて閉鎖部
とし、更にこの他方側において半田付けランドを
形成したことを特徴とする厚膜配線基板。 A hole with a relatively small diameter is formed in a predetermined portion of a substrate made of an insulating material, and a thick film electrode is formed on one side of this substrate, and when a through-hole electrode is formed in the hole, a hole is formed on the other side of the substrate. A thick film wiring board characterized in that it is clogged to form a closed part and further has a soldering land formed on the other side thereof.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16480688U JPH0621271Y2 (en) | 1988-12-19 | 1988-12-19 | Thick film wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16480688U JPH0621271Y2 (en) | 1988-12-19 | 1988-12-19 | Thick film wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0284367U true JPH0284367U (en) | 1990-06-29 |
| JPH0621271Y2 JPH0621271Y2 (en) | 1994-06-01 |
Family
ID=31450726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16480688U Expired - Lifetime JPH0621271Y2 (en) | 1988-12-19 | 1988-12-19 | Thick film wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0621271Y2 (en) |
-
1988
- 1988-12-19 JP JP16480688U patent/JPH0621271Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0621271Y2 (en) | 1994-06-01 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |