JPS6437896A - Braking and manufacture of photosensitive solder resist in printed board - Google Patents

Abstract

PURPOSE:To eliminate the need for alignment with a printed wiring formed to a substrate on the baking of a photosensitive solder resist by photosensitizing the solder resist shaped onto the side face of the wiring on the surface of the printed board by the transmitted light of an insulating substrate and baking the solder resist onto the surface of the substrate. CONSTITUTION:In an insulating substrate 1, a photosensitive solder resist 4 is applied onto the whole surface on the surface side of a printed board 2 in specified thickness while the resist 4 is exposed through the substrate 1 by a predetermined light source 5 from the rear side of the substrate 1. When the resist is heated and baked by hot air, etc., under the state, a non-exposure section 4a, in which the transmission of light from the light source 5 is prevented by the pattern of the wiring 2 and a shadow section is shaped, is removed from the surface of the wiring 2 while an exposure section 4b is solidified, and fixed onto the surface of the substrate 1 between the wirings 2, 2, thus constituting a printed board on which the resist 3 is distributed. Accordingly, the solder resist can be executed onto the surface of the substrate among the wirings requiring no alignment with the printed wirings formed onto the substrate.