JPS6441155U - - Google Patents

Info

Publication number
JPS6441155U
JPS6441155U JP1987137167U JP13716787U JPS6441155U JP S6441155 U JPS6441155 U JP S6441155U JP 1987137167 U JP1987137167 U JP 1987137167U JP 13716787 U JP13716787 U JP 13716787U JP S6441155 U JPS6441155 U JP S6441155U
Authority
JP
Japan
Prior art keywords
control
led display
led chip
display body
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987137167U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987137167U priority Critical patent/JPS6441155U/ja
Publication of JPS6441155U publication Critical patent/JPS6441155U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP1987137167U 1987-09-07 1987-09-07 Pending JPS6441155U (2)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987137167U JPS6441155U (2) 1987-09-07 1987-09-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987137167U JPS6441155U (2) 1987-09-07 1987-09-07

Publications (1)

Publication Number Publication Date
JPS6441155U true JPS6441155U (2) 1989-03-13

Family

ID=31398346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987137167U Pending JPS6441155U (2) 1987-09-07 1987-09-07

Country Status (1)

Country Link
JP (1) JPS6441155U (2)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347434A (ja) * 1992-06-12 1993-12-27 Sharp Corp 抵抗内蔵型発光装置
JP2016213417A (ja) * 2015-05-13 2016-12-15 ローム株式会社 半導体発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS532174B2 (2) * 1973-09-21 1978-01-26
JPS5825287A (ja) * 1982-07-12 1983-02-15 Mitsubishi Electric Corp 半導体感光発光素子
JPS6070784A (ja) * 1983-09-27 1985-04-22 Sharp Corp 発光ダイオ−ド表示装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS532174B2 (2) * 1973-09-21 1978-01-26
JPS5825287A (ja) * 1982-07-12 1983-02-15 Mitsubishi Electric Corp 半導体感光発光素子
JPS6070784A (ja) * 1983-09-27 1985-04-22 Sharp Corp 発光ダイオ−ド表示装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05347434A (ja) * 1992-06-12 1993-12-27 Sharp Corp 抵抗内蔵型発光装置
JP2016213417A (ja) * 2015-05-13 2016-12-15 ローム株式会社 半導体発光装置

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