JPS6441249A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS6441249A JPS6441249A JP19748487A JP19748487A JPS6441249A JP S6441249 A JPS6441249 A JP S6441249A JP 19748487 A JP19748487 A JP 19748487A JP 19748487 A JP19748487 A JP 19748487A JP S6441249 A JPS6441249 A JP S6441249A
- Authority
- JP
- Japan
- Prior art keywords
- base part
- mounting
- time
- package
- thermal insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 239000012212 insulator Substances 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 2
- 229920005989 resin Polymers 0.000 abstract 2
- 229910001285 shape-memory alloy Inorganic materials 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 230000035939 shock Effects 0.000 abstract 1
- 230000007704 transition Effects 0.000 abstract 1
- 230000008016 vaporization Effects 0.000 abstract 1
- 238000009834 vaporization Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE:To prevent the generation of crack, blister, etc. of a package at the time of mounting, by bonding shape memory alloy on the rear main surface of a base part mounting a semiconductor element, via a thermal insulator. CONSTITUTION:A semiconductor device is formed by sealing a semiconductor element 1 with resin 8. At that time, on the rear main surface of a base part 3, shape memory alloy 7 is bonded via thermal insulator 9. Since the temperature rises up to a range of 210-260 deg.C at the time of solder-reflow mounting, the alloy 7 generates inverse transition, and absorbs the thermal shock stress of the base part 3 and the resin 8. Therefore, the stress of the whole package is relieved. Further, by the thermal insulation effect of the thermal insulator 9, the vaporization of water content in the vicinity of the base part 3 is reduced. Thereby, the generation of crack, blister, etc. of a package at the time of mounting is prevented.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19748487A JPS6441249A (en) | 1987-08-06 | 1987-08-06 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19748487A JPS6441249A (en) | 1987-08-06 | 1987-08-06 | Semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6441249A true JPS6441249A (en) | 1989-02-13 |
Family
ID=16375239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19748487A Pending JPS6441249A (en) | 1987-08-06 | 1987-08-06 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6441249A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5132873A (en) * | 1988-09-30 | 1992-07-21 | Microelectronics And Computer Technology Corporation | Diaphragm sealing apparatus |
| US6698177B1 (en) | 1999-01-28 | 2004-03-02 | Delta Kogyo Co, Ltd | Cam mechanism for translation of circular motion into reciprocal motion |
| CN103426834A (en) * | 2013-08-21 | 2013-12-04 | 中国工程物理研究院电子工程研究所 | Pressure stabilizing device for electronic sealing device |
-
1987
- 1987-08-06 JP JP19748487A patent/JPS6441249A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5132873A (en) * | 1988-09-30 | 1992-07-21 | Microelectronics And Computer Technology Corporation | Diaphragm sealing apparatus |
| US6698177B1 (en) | 1999-01-28 | 2004-03-02 | Delta Kogyo Co, Ltd | Cam mechanism for translation of circular motion into reciprocal motion |
| CN103426834A (en) * | 2013-08-21 | 2013-12-04 | 中国工程物理研究院电子工程研究所 | Pressure stabilizing device for electronic sealing device |
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