JPS6449247A - Semiconductor light emitting device - Google Patents

Semiconductor light emitting device

Info

Publication number
JPS6449247A
JPS6449247A JP62206860A JP20686087A JPS6449247A JP S6449247 A JPS6449247 A JP S6449247A JP 62206860 A JP62206860 A JP 62206860A JP 20686087 A JP20686087 A JP 20686087A JP S6449247 A JPS6449247 A JP S6449247A
Authority
JP
Japan
Prior art keywords
light emitting
semiconductor light
submount
emitting device
heatsink
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62206860A
Other languages
Japanese (ja)
Inventor
Kimio Shigihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP62206860A priority Critical patent/JPS6449247A/en
Publication of JPS6449247A publication Critical patent/JPS6449247A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Led Device Packages (AREA)

Abstract

PURPOSE:To expand the heat radiation area of a submount and reduce the thermal resistance of a semiconductor light emitting device by burying the submount in a heatsink. CONSTITUTION:A semiconductor light emitting device is composed of a semiconductor light emitting element 2, a heatsink 12 for radiating heat produced by the element 2 and a submount 11 for relieving strain produced by the heat of the element 2. At that time, the submount 11 is buried in the heatsink 12. Therefore, the heat produced by the element 2 and transmitted to the submount 11 is transmitted into the heatsink 12 not only through the bottom surface but also through the side surfaces of the submount 11. With this constitution, the thermal resistance of the semiconductor light emitting device can be reduced.
JP62206860A 1987-08-19 1987-08-19 Semiconductor light emitting device Pending JPS6449247A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62206860A JPS6449247A (en) 1987-08-19 1987-08-19 Semiconductor light emitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62206860A JPS6449247A (en) 1987-08-19 1987-08-19 Semiconductor light emitting device

Publications (1)

Publication Number Publication Date
JPS6449247A true JPS6449247A (en) 1989-02-23

Family

ID=16530241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62206860A Pending JPS6449247A (en) 1987-08-19 1987-08-19 Semiconductor light emitting device

Country Status (1)

Country Link
JP (1) JPS6449247A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158957A (en) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd Light emitting device
WO2011072297A3 (en) * 2009-12-12 2011-09-22 Molex Incorporated Cooling device and electronic device
WO2013179623A1 (en) * 2012-05-31 2013-12-05 パナソニック株式会社 Led module
JP2016500485A (en) * 2012-12-21 2016-01-12 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ Component carrier and component carrier assembly

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005158957A (en) * 2003-11-25 2005-06-16 Matsushita Electric Works Ltd Light emitting device
WO2011072297A3 (en) * 2009-12-12 2011-09-22 Molex Incorporated Cooling device and electronic device
US9057565B2 (en) 2009-12-12 2015-06-16 Molex Incorporated Cooling device and electronic device
WO2013179623A1 (en) * 2012-05-31 2013-12-05 パナソニック株式会社 Led module
JPWO2013179623A1 (en) * 2012-05-31 2016-01-18 パナソニックＩｐマネジメント株式会社 LED module
JP2016500485A (en) * 2012-12-21 2016-01-12 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ Component carrier and component carrier assembly
US10021776B2 (en) 2012-12-21 2018-07-10 Epcos Ag Component carrier and component carrier arrangement
JP2018139317A (en) * 2012-12-21 2018-09-06 エプコス アクチエンゲゼルシャフトＥｐｃｏｓ Ａｇ Component carrier and component carrier assembly

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