JPS6442193A - Wiring board - Google Patents

Wiring board

Info

Publication number
JPS6442193A
JPS6442193A JP62198499A JP19849987A JPS6442193A JP S6442193 A JPS6442193 A JP S6442193A JP 62198499 A JP62198499 A JP 62198499A JP 19849987 A JP19849987 A JP 19849987A JP S6442193 A JPS6442193 A JP S6442193A
Authority
JP
Japan
Prior art keywords
solder
resin film
wiring pattern
solder layers
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62198499A
Other languages
Japanese (ja)
Inventor
Yoshinobu Kishimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP62198499A priority Critical patent/JPS6442193A/en
Publication of JPS6442193A publication Critical patent/JPS6442193A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

PURPOSE:To avoid a short-circuit caused by solder flow at the time of soldering and improve the workability and maintain a connection strength by a method wherein a resin film with melting point lower than that of solder is applied so as to cover solder layers and non-wiring pattern parts. CONSTITUTION:The lead electrodes 6 of a board 1 and the copper foil wiring patterns 12 of a flexible board 7 are brought into contact with each other and heat is applied while the flexible circuit is pressed against the board 1. When the heating is continued, the resin film 15 of the flexible 7 is softened and the resin film 15 above the solder layers 13 are pushed aside and the resin film 15 above non-wiring pattern parts 14 is also melted to flow into the non- wiring pattern parts between the lead electrodes 6. By continuing heating, the solder layers 13 of the flexible board 7 and the solder layers 6a on the lead electrodes 6 are melted together to complete soldering. Further, a resin film with a melting point lower than that of solder is applied so as to cover the solder layers and the non-wiring pattern parts. With this constitution, adhesion strength can be maintained and the creation of openings at the soldered parts can be suppressed.
JP62198499A 1987-08-07 1987-08-07 Wiring board Pending JPS6442193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62198499A JPS6442193A (en) 1987-08-07 1987-08-07 Wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62198499A JPS6442193A (en) 1987-08-07 1987-08-07 Wiring board

Publications (1)

Publication Number Publication Date
JPS6442193A true JPS6442193A (en) 1989-02-14

Family

ID=16392146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62198499A Pending JPS6442193A (en) 1987-08-07 1987-08-07 Wiring board

Country Status (1)

Country Link
JP (1) JPS6442193A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2724052A1 (en) * 1994-08-31 1996-03-01 Nec Corp ELECTRONIC DEVICE ASSEMBLY AND MANUFACTURING METHOD THEREOF.
WO1998004107A1 (en) * 1996-07-23 1998-01-29 Minnesota Mining And Manufacturing Company Z-axis interconnect method and circuit
US5917149A (en) * 1997-05-15 1999-06-29 Daimlerchrysler Corporation Flexible circuit board interconnect with strain relief
US5924873A (en) * 1997-05-15 1999-07-20 Chrysler Corporation Flexible circuit board interconnect with strain relief
US5976910A (en) * 1995-08-30 1999-11-02 Nec Corporation Electronic device assembly and a manufacturing method of the same
US5981870A (en) * 1997-05-15 1999-11-09 Chrysler Corporation Flexible circuit board interconnect with strain relief
JP2002232132A (en) * 2001-01-30 2002-08-16 Denso Corp Board connection method
JP2012033954A (en) * 2006-10-10 2012-02-16 Sumitomo Electric Ind Ltd Wiring board connecting body and wiring board module
JPWO2022172583A1 (en) * 2021-02-15 2022-08-18

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5896276A (en) * 1994-08-31 1999-04-20 Nec Corporation Electronic assembly package including connecting member between first and second substrates
FR2724052A1 (en) * 1994-08-31 1996-03-01 Nec Corp ELECTRONIC DEVICE ASSEMBLY AND MANUFACTURING METHOD THEREOF.
US5976910A (en) * 1995-08-30 1999-11-02 Nec Corporation Electronic device assembly and a manufacturing method of the same
US5873161A (en) * 1996-07-23 1999-02-23 Minnesota Mining And Manufacturing Company Method of making a Z axis interconnect circuit
WO1998004107A1 (en) * 1996-07-23 1998-01-29 Minnesota Mining And Manufacturing Company Z-axis interconnect method and circuit
US5917149A (en) * 1997-05-15 1999-06-29 Daimlerchrysler Corporation Flexible circuit board interconnect with strain relief
US5924873A (en) * 1997-05-15 1999-07-20 Chrysler Corporation Flexible circuit board interconnect with strain relief
US5981870A (en) * 1997-05-15 1999-11-09 Chrysler Corporation Flexible circuit board interconnect with strain relief
JP2002232132A (en) * 2001-01-30 2002-08-16 Denso Corp Board connection method
JP2012033954A (en) * 2006-10-10 2012-02-16 Sumitomo Electric Ind Ltd Wiring board connecting body and wiring board module
JPWO2022172583A1 (en) * 2021-02-15 2022-08-18
WO2022172583A1 (en) * 2021-02-15 2022-08-18 株式会社村田製作所 Connection structure and method for producing connection structure
US12324098B2 (en) 2021-02-15 2025-06-03 Murata Manufacturing Co., Ltd. Connection structure and connection structure manufacturing method

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