JPS6484690A - Printed wiring board and the production thereof - Google Patents
Printed wiring board and the production thereofInfo
- Publication number
- JPS6484690A JPS6484690A JP24194487A JP24194487A JPS6484690A JP S6484690 A JPS6484690 A JP S6484690A JP 24194487 A JP24194487 A JP 24194487A JP 24194487 A JP24194487 A JP 24194487A JP S6484690 A JPS6484690 A JP S6484690A
- Authority
- JP
- Japan
- Prior art keywords
- degradation
- layer
- conductor
- insulating layer
- conductor run
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 abstract 7
- 238000006731 degradation reaction Methods 0.000 abstract 7
- 239000000463 material Substances 0.000 abstract 6
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 2
- 230000015556 catabolic process Effects 0.000 abstract 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052759 nickel Inorganic materials 0.000 abstract 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 abstract 1
- 239000011701 zinc Substances 0.000 abstract 1
- 229910052725 zinc Inorganic materials 0.000 abstract 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
PURPOSE:To prevent the degradation of the bonding interface between a conductor run and an insulating layer, and to prevent the lowering of the adhesive strength therebetween, by bonding the conductor runs forming a circuit pattern to the insulating layer through an anti-degradation layer of chemically stable material. CONSTITUTION:Conductor runs 4 which form a circuit pattern are bonded to an insulating layer 5, respectively, through an anti-degradation layer 13 of chemically stable material. As a result, when this printed wiring board A is produced or after the production thereof, even if the board A is exposed to the high temperature atmosphere for a long time, the adhesive strength between the anti-degradation layer 13 and the insulating layer 5 can be effectively prevented from being lowered. Moreover, since the degradation of the conductor run 4 is also prevented, the adhesive strength between the conductor run 4 and the anti-degradation layer 13 is correspondingly prevented from being lowered. Now, when the material of the conductor run 4 is copper, the material of the anti-degradation layer 13 employs zinc, nickel, chromium or the like, and when the material of the conductor run 4 is aluminum, then the material of the layer 13 employs aluminum oxide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62241944A JP2501842B2 (en) | 1987-09-26 | 1987-09-26 | Printed wiring board manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62241944A JP2501842B2 (en) | 1987-09-26 | 1987-09-26 | Printed wiring board manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6484690A true JPS6484690A (en) | 1989-03-29 |
| JP2501842B2 JP2501842B2 (en) | 1996-05-29 |
Family
ID=17081891
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62241944A Expired - Lifetime JP2501842B2 (en) | 1987-09-26 | 1987-09-26 | Printed wiring board manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2501842B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005172496A (en) * | 2003-12-09 | 2005-06-30 | Matsushita Electric Ind Co Ltd | Load sensor and manufacturing method thereof |
| WO2005053367A3 (en) * | 2003-10-30 | 2005-08-25 | Yazaki Europe Ltd | Method and apparatus for the manufacture of electric circuits |
| JP2007103440A (en) * | 2005-09-30 | 2007-04-19 | Mitsui Mining & Smelting Co Ltd | Wiring board manufacturing method and wiring board |
| JP2010232338A (en) * | 2009-03-26 | 2010-10-14 | Kyocera Corp | Wiring board and probe card board |
| JP2013102248A (en) * | 2013-03-08 | 2013-05-23 | Shinko Electric Ind Co Ltd | Manufacturing method of wiring board and manufacturing method of semiconductor package |
| JP2023171155A (en) * | 2022-05-20 | 2023-12-01 | パナソニックＩｐマネジメント株式会社 | Mounted board, mounting board manufacturing method, and mounted board intermediate |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5687695A (en) * | 1979-12-19 | 1981-07-16 | Nippon Mining Co Ltd | Copper foil for printed circuit and its manufacture |
| JPS61183152A (en) * | 1985-02-07 | 1986-08-15 | Asahi Glass Co Ltd | Glass substrate |
-
1987
- 1987-09-26 JP JP62241944A patent/JP2501842B2/en not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5687695A (en) * | 1979-12-19 | 1981-07-16 | Nippon Mining Co Ltd | Copper foil for printed circuit and its manufacture |
| JPS61183152A (en) * | 1985-02-07 | 1986-08-15 | Asahi Glass Co Ltd | Glass substrate |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005053367A3 (en) * | 2003-10-30 | 2005-08-25 | Yazaki Europe Ltd | Method and apparatus for the manufacture of electric circuits |
| JP2005172496A (en) * | 2003-12-09 | 2005-06-30 | Matsushita Electric Ind Co Ltd | Load sensor and manufacturing method thereof |
| JP2007103440A (en) * | 2005-09-30 | 2007-04-19 | Mitsui Mining & Smelting Co Ltd | Wiring board manufacturing method and wiring board |
| JP2010232338A (en) * | 2009-03-26 | 2010-10-14 | Kyocera Corp | Wiring board and probe card board |
| JP2013102248A (en) * | 2013-03-08 | 2013-05-23 | Shinko Electric Ind Co Ltd | Manufacturing method of wiring board and manufacturing method of semiconductor package |
| JP2023171155A (en) * | 2022-05-20 | 2023-12-01 | パナソニックＩｐマネジメント株式会社 | Mounted board, mounting board manufacturing method, and mounted board intermediate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2501842B2 (en) | 1996-05-29 |
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