JPS64431A - Semiconductor pressure sensor - Google Patents

Semiconductor pressure sensor

Info

Publication number
JPS64431A
JPS64431A JP62030079A JP3007987A JPS64431A JP S64431 A JPS64431 A JP S64431A JP 62030079 A JP62030079 A JP 62030079A JP 3007987 A JP3007987 A JP 3007987A JP S64431 A JPS64431 A JP S64431A
Authority
JP
Japan
Prior art keywords
substrate
pressure sensor
semiconductor pressure
chip
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62030079A
Other languages
English (en)
Other versions
JPH061226B2 (ja
JPH01431A (ja
Inventor
Hiroshi Okada
Yukihiro Katou
Osamu Ina
Kazuhisa Ikeda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denso Corp
Original Assignee
NipponDenso Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NipponDenso Co Ltd filed Critical NipponDenso Co Ltd
Priority to JP62030079A priority Critical patent/JPH061226B2/ja
Priority to US07/046,582 priority patent/US4838089A/en
Publication of JPS64431A publication Critical patent/JPS64431A/ja
Publication of JPH01431A publication Critical patent/JPH01431A/ja
Publication of JPH061226B2 publication Critical patent/JPH061226B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • G01L19/0038—Fluidic connecting means being part of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP62030079A 1986-05-07 1987-02-12 半導体圧力センサ Expired - Lifetime JPH061226B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP62030079A JPH061226B2 (ja) 1986-05-07 1987-02-12 半導体圧力センサ
US07/046,582 US4838089A (en) 1986-05-07 1987-05-06 Semiconductor pressure sensor

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP10445886 1986-05-07
JP61-104458 1986-05-07
JP859487 1987-01-16
JP62-8594 1987-01-16
JP62030079A JPH061226B2 (ja) 1986-05-07 1987-02-12 半導体圧力センサ

Publications (3)

Publication Number Publication Date
JPS64431A true JPS64431A (en) 1989-01-05
JPH01431A JPH01431A (ja) 1989-01-05
JPH061226B2 JPH061226B2 (ja) 1994-01-05

Family

ID=27278092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62030079A Expired - Lifetime JPH061226B2 (ja) 1986-05-07 1987-02-12 半導体圧力センサ

Country Status (2)

Country Link
US (1) US4838089A (ja)
JP (1) JPH061226B2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005260191A (ja) * 2004-03-15 2005-09-22 Sanyo Electric Co Ltd 回路装置
JP2006329883A (ja) * 2005-05-27 2006-12-07 Hitachi Ltd 気体圧力検知装置

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US5099738A (en) * 1989-01-03 1992-03-31 Hotz Instruments Technology, Inc. MIDI musical translator
DE4009377A1 (de) * 1990-03-23 1991-10-02 Bosch Gmbh Robert Druckgeber zur druckerfassung im brennraum von brennkraftmaschinen
DE4011314A1 (de) * 1990-04-07 1991-10-10 Hottinger Messtechnik Baldwin Dehnungsmessstreifen und messgroessenaufnehmer mit derartigen dehnungsmessstreifen
FR2667395B1 (fr) * 1990-09-28 1992-12-31 Jaeger Dispositif de mesure de la pression d'admission du melange air/carburant dans un moteur de vehicule automobile.
JP2719448B2 (ja) * 1991-01-24 1998-02-25 三菱電機株式会社 半導体圧力検出装置
JPH04258176A (ja) * 1991-02-12 1992-09-14 Mitsubishi Electric Corp 半導体圧力センサ
US5333505A (en) * 1992-01-13 1994-08-02 Mitsubishi Denki Kabushiki Kaisha Semiconductor pressure sensor for use at high temperature and pressure and method of manufacturing same
JPH05203522A (ja) * 1992-01-23 1993-08-10 Mitsubishi Electric Corp モールドパッケージ半導体圧力センサおよびその製造方法
JP3092307B2 (ja) * 1992-04-16 2000-09-25 富士電機株式会社 半導体圧力センサ
USD348042S (en) 1992-12-17 1994-06-21 Honeywell, Inc. Absolute pressure transducer
FR2707002A1 (en) * 1993-06-21 1994-12-30 Jaeger Improved screened electrical sensor
DE4400941C1 (de) * 1994-01-14 1995-04-20 Pvb Medizintechnik Gmbh Druckmeßwandler zur Messung des Druckes einer Flüssigkeit, insbesondere zur invasiven Blutdruckmessung
US5459351A (en) * 1994-06-29 1995-10-17 Honeywell Inc. Apparatus for mounting an absolute pressure sensor
JPH08233848A (ja) * 1995-02-28 1996-09-13 Mitsubishi Electric Corp 半導体センサ
US6140144A (en) * 1996-08-08 2000-10-31 Integrated Sensing Systems, Inc. Method for packaging microsensors
US5948991A (en) * 1996-12-09 1999-09-07 Denso Corporation Semiconductor physical quantity sensor device having semiconductor sensor chip integrated with semiconductor circuit chip
DE19703206C2 (de) * 1997-01-29 2002-01-24 Infineon Technologies Ag Drucksensor-Bauteil mit Schlauchanschluß
US6053049A (en) * 1997-05-30 2000-04-25 Motorola Inc. Electrical device having atmospheric isolation
JPH1164137A (ja) * 1997-08-25 1999-03-05 Hitachi Ltd 半導体圧力センサ
JP3532776B2 (ja) * 1998-10-20 2004-05-31 株式会社日立製作所 自動車用センサの取付け構造
US6092425A (en) * 1999-02-24 2000-07-25 Delco Electronics Corp. Differential pressure sensor having an alloy or metal isolator
EP1211722B9 (en) * 2000-11-30 2005-07-13 STMicroelectronics S.r.l. Manufacturing method of electronic device package
DE20105505U1 (de) * 2001-03-29 2002-08-01 Keller AG für Druckmeßtechnik, Winterthur Drucktransmitter
DE10331967A1 (de) * 2003-07-15 2005-02-03 Robert Bosch Gmbh Sensoreinrichtung
US7275445B2 (en) * 2003-08-11 2007-10-02 Honeywell International, Inc Modular pressure sensor drive connectable to a computer
US7199438B2 (en) * 2003-09-23 2007-04-03 Advanced Semiconductor Engineering, Inc. Overmolded optical package
US6927482B1 (en) * 2003-10-01 2005-08-09 General Electric Company Surface mount package and method for forming multi-chip microsensor device
US7080559B1 (en) * 2005-03-08 2006-07-25 Sensfab Pte Ltd Transducer
DE102005054177B4 (de) * 2005-11-14 2011-12-22 Infineon Technologies Ag Verfahren zum Herstellen einer Vielzahl von gehäusten Sensormodulen
US7238897B2 (en) * 2005-12-07 2007-07-03 Taiwan Ic Packaging Corporation Contact sensor and method for making the same
USD570281S1 (en) * 2006-04-21 2008-06-03 Raztec Limited Device housing
FR2901875A1 (fr) * 2006-05-31 2007-12-07 Taema Sa Dispositif indicateur d'une grandeur physique
EP2029973A1 (fr) * 2006-05-31 2009-03-04 L'Air Liquide Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude Dispositif indicateur d'une grandeur physique
FR2901874B1 (fr) * 2006-05-31 2008-08-15 Taema Sa Dispositif indicateur d'une grandeur physique
FR2901876B1 (fr) * 2006-05-31 2008-10-03 Taema Sa Dispositif indicateur d'une grandeur physique
US7468556B2 (en) * 2006-06-19 2008-12-23 Lv Sensors, Inc. Packaging of hybrid integrated circuits
US7607355B2 (en) * 2007-02-16 2009-10-27 Yamaha Corporation Semiconductor device
FR2915801B1 (fr) * 2007-05-03 2009-07-17 Taema Sa Procede de controle d'un lot homogene de bouteilles de fluide sous pression
FR2915798B1 (fr) * 2007-05-03 2010-04-30 Taema Procede de pilotage d'un manometre electronique et manometre correspondant
FR2915799B1 (fr) * 2007-05-03 2010-10-01 Taema Manometre electronique de mesure de la pression regnant a l'interieur d'un recipient
JP5355867B2 (ja) * 2007-07-10 2013-11-27 ローム株式会社 集積回路素子
US8148808B2 (en) * 2007-08-13 2012-04-03 Lv Sensors, Inc. Partitioning of electronic packages
DE102008000786A1 (de) * 2008-03-20 2009-09-24 Robert Bosch Gmbh Sensorvorrichtung und Verfahren zur Herstellung einer Sensorvorrichtung
US7832278B2 (en) * 2008-05-29 2010-11-16 Hong Kong Applied Science And Technology Research Institute Co., Ltd. Multi-chip package
JP5315028B2 (ja) * 2008-12-04 2013-10-16 ルネサスエレクトロニクス株式会社 電子装置および電子装置の製造方法
WO2010113712A1 (ja) * 2009-03-31 2010-10-07 アルプス電気株式会社 容量型湿度センサ及びその製造方法
DE102010031679A1 (de) * 2010-07-22 2012-01-26 Robert Bosch Gmbh Drucksensor sowie Verfahren zum Herstellen eines Drucksensors
NL2009949C2 (en) * 2012-12-10 2014-06-11 Stertil Bv Lifting column for lifting a load, lifting system provided therewith and method for measuring a load.
JP6352414B2 (ja) * 2014-06-17 2018-07-04 株式会社鷺宮製作所 センサユニット、および、それを備える圧力検出装置
US11815504B2 (en) 2016-07-11 2023-11-14 Quipip, Llc Sensor device, and systems and methods for obtaining measurements of selected characteristics of a concrete mixture
US10126288B2 (en) * 2016-07-11 2018-11-13 Quipip, Llc Sensor device, and systems and methods for obtaining measurements of selected characteristics of a concrete mixture
US10826208B1 (en) * 2017-01-30 2020-11-03 Superior Sensor Technology Sensor with integrated electrical contacts
US11225409B2 (en) 2018-09-17 2022-01-18 Invensense, Inc. Sensor with integrated heater
US11837513B2 (en) * 2019-07-17 2023-12-05 Texas Instruments Incorporated O-ring seals for fluid sensing

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5744691A (en) * 1980-08-29 1982-03-13 Osaka Gas Co Ltd Sealing agent for piping
US4295117A (en) * 1980-09-11 1981-10-13 General Motors Corporation Pressure sensor assembly
JPS5766328A (en) * 1980-10-13 1982-04-22 Hitachi Ltd Semiconductor pressure sensor
JPS57169644A (en) * 1981-04-14 1982-10-19 Nippon Denso Co Ltd Semiconductor type pressure sensor
JPS5935101B2 (ja) * 1983-11-04 1984-08-27 松下電器産業株式会社 テ−プレコ−ダ
JPS60149938A (ja) * 1984-01-16 1985-08-07 Nippon Denso Co Ltd 半導体圧力センサの製造方法
JPS60171429A (ja) * 1984-02-17 1985-09-04 Citizen Watch Co Ltd 圧力電気変換器

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005260191A (ja) * 2004-03-15 2005-09-22 Sanyo Electric Co Ltd 回路装置
JP2006329883A (ja) * 2005-05-27 2006-12-07 Hitachi Ltd 気体圧力検知装置

Also Published As

Publication number Publication date
US4838089A (en) 1989-06-13
JPH061226B2 (ja) 1994-01-05

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