JPS6444031A - Connection of oxide superconducting circuit - Google Patents
Connection of oxide superconducting circuitInfo
- Publication number
- JPS6444031A JPS6444031A JP62201620A JP20162087A JPS6444031A JP S6444031 A JPS6444031 A JP S6444031A JP 62201620 A JP62201620 A JP 62201620A JP 20162087 A JP20162087 A JP 20162087A JP S6444031 A JPS6444031 A JP S6444031A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- carrier
- laser
- heating means
- circuit substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Containers, Films, And Cooling For Superconductive Devices (AREA)
- Wire Bonding (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
Abstract
PURPOSE:To rigidly bond the contact of a circuit substrate to a lead part of a chip carrier and to shorten workhours by employing a condensing and heating means such as a laser or the like to bond the two by heating the contact part between the contact of the circuit substrate and the lead part of the carrier. CONSTITUTION:A circuit substrate 2 is placed on the upper face 3a of a chip carrier 3. It is necessary to contact a connecting part 5 formed on the lower face 2a of the substrate 1 1:1 with a lead part 6 formed on the upper face 3a of the carrier 3 at this time. Then, the contact part is heated by condensing and heating means through the carrier 3 from below the carrier 3 made of a transparent material. The heating means preferably employs a laser, such as a carbon dioxide gas laser, a YAG laser, an argon laser, an image, etc. Thus, since only a part having extremely small contact part can be concentrically heated at a high temperature, the contact part 5 can be rigidly bonded to the lead part 6 to shorten the workhours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62201620A JPS6444031A (en) | 1987-08-12 | 1987-08-12 | Connection of oxide superconducting circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62201620A JPS6444031A (en) | 1987-08-12 | 1987-08-12 | Connection of oxide superconducting circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6444031A true JPS6444031A (en) | 1989-02-16 |
Family
ID=16444080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62201620A Pending JPS6444031A (en) | 1987-08-12 | 1987-08-12 | Connection of oxide superconducting circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6444031A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022503598A (en) * | 2018-10-29 | 2022-01-12 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Dielectric holder for quantum devices |
-
1987
- 1987-08-12 JP JP62201620A patent/JPS6444031A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2022503598A (en) * | 2018-10-29 | 2022-01-12 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Dielectric holder for quantum devices |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| HK69784A (en) | Fabrication of circuit packages | |
| JPS5753947A (en) | Transistor and electronic device containing it | |
| EP0321142A3 (en) | Soldering method using localized heat source | |
| FI931552A0 (en) | CELL FOER MAETNING AV EL-LEDNINGSFOERMAOGA | |
| EP0303521A3 (en) | Superconducting device and methods of manufacturing the same | |
| JPS6454740A (en) | Integrated circuit and manufacture thereof | |
| JPS5753948A (en) | Mounting method of semiconductor element | |
| JPS5483374A (en) | Chip bonding process | |
| JPS5523607A (en) | Crystal oscillator | |
| JPS57106141A (en) | Connecting method for hybrid integrated circuit substrate to semiconductor pellet | |
| JPS5585037A (en) | Bonding method | |
| JPS5640267A (en) | Pretinning method for flat lead | |
| JPS5626692A (en) | Welding method | |
| JPS5543811A (en) | Semiconductor integrated circuit device | |
| JPS52125272A (en) | Substrate to which semiconductor device is mounted | |
| JPS6491118A (en) | Liquid crystal display element mounting flip chip | |
| JPS6420633A (en) | Manufacture of semiconductor device | |
| JPS5660025A (en) | Bonding method for semiconductor element | |
| JPS5797213A (en) | Supporting method of quartz oscillator | |
| JPS551105A (en) | Jig for replacing chip of semiconductor device | |
| JPS5254374A (en) | Semiconductor chip bonding method | |
| JPS57102032A (en) | Manufacture of semiconductor element | |
| JPS5722077A (en) | Thermal head | |
| JPS6442893A (en) | Circuit substrate | |
| JPS54110786A (en) | Manufacture of semiconductor device |