JPS5543811A - Semiconductor integrated circuit device - Google Patents

Semiconductor integrated circuit device

Info

Publication number
JPS5543811A
JPS5543811A JP11578778A JP11578778A JPS5543811A JP S5543811 A JPS5543811 A JP S5543811A JP 11578778 A JP11578778 A JP 11578778A JP 11578778 A JP11578778 A JP 11578778A JP S5543811 A JPS5543811 A JP S5543811A
Authority
JP
Japan
Prior art keywords
electrode
tip
solder
connection
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11578778A
Other languages
Japanese (ja)
Other versions
JPS6059743B2 (en
Inventor
Muneo Oshima
Masanori Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP53115787A priority Critical patent/JPS6059743B2/en
Publication of JPS5543811A publication Critical patent/JPS5543811A/en
Publication of JPS6059743B2 publication Critical patent/JPS6059743B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE: To prolong fatigue breakage life due to repetitive displasement by controlling shape of a solder bump surrounding tip for electrical connection by a bump in the tip's center section.
CONSTITUTION: By changing size of solder bumps on an IC tip 1, respectively required volumes of bumps are achieved on an electrode 2 and a control electrode 11. On a base board on which pedestals are formed in positions corresponding to the electrode 2 and the control electrode 11, positioning is made with face down and heated to melt for completion of connection. As a solder column 9 is to have stretched connection intervals due to a solder column 10 if the control section, its fatigue breakage life can be prolonged.
COPYRIGHT: (C)1980,JPO&Japio
JP53115787A 1978-09-22 1978-09-22 Semiconductor integrated circuit device Expired JPS6059743B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP53115787A JPS6059743B2 (en) 1978-09-22 1978-09-22 Semiconductor integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP53115787A JPS6059743B2 (en) 1978-09-22 1978-09-22 Semiconductor integrated circuit device

Publications (2)

Publication Number Publication Date
JPS5543811A true JPS5543811A (en) 1980-03-27
JPS6059743B2 JPS6059743B2 (en) 1985-12-26

Family

ID=14671050

Family Applications (1)

Application Number Title Priority Date Filing Date
JP53115787A Expired JPS6059743B2 (en) 1978-09-22 1978-09-22 Semiconductor integrated circuit device

Country Status (1)

Country Link
JP (1) JPS6059743B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5726861A (en) * 1995-01-03 1998-03-10 Ostrem; Fred E. Surface mount component height control
JP2018107371A (en) * 2016-12-28 2018-07-05 日亜化学工業株式会社 Light emitting device and manufacturing method thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3353534B2 (en) * 1995-04-27 2002-12-03 株式会社日立製作所 Electronic circuit device and electronic circuit components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5726861A (en) * 1995-01-03 1998-03-10 Ostrem; Fred E. Surface mount component height control
JP2018107371A (en) * 2016-12-28 2018-07-05 日亜化学工業株式会社 Light emitting device and manufacturing method thereof

Also Published As

Publication number Publication date
JPS6059743B2 (en) 1985-12-26

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