JPS6445150A - Manufacture of electronic component - Google Patents
Manufacture of electronic componentInfo
- Publication number
- JPS6445150A JPS6445150A JP20077687A JP20077687A JPS6445150A JP S6445150 A JPS6445150 A JP S6445150A JP 20077687 A JP20077687 A JP 20077687A JP 20077687 A JP20077687 A JP 20077687A JP S6445150 A JPS6445150 A JP S6445150A
- Authority
- JP
- Japan
- Prior art keywords
- recessed part
- electrode
- supporting member
- metal particles
- bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002923 metal particle Substances 0.000 abstract 3
- 230000000717 retained effect Effects 0.000 abstract 2
- 238000005259 measurement Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
PURPOSE:To make it possible to easily form a bump of a uniform height by a method wherein the surface of a supporting member which is conductive except its recessed part is electrified, electric charge is accumulated at the recessed part only, microscopic metal particles are scattered on the surface of the supporting member, the metal particles are retained by the electrostatic force of the recessed part, and they are transferred to the electrode of an IC. CONSTITUTION:A supporting member 11, having a recessed part 12 on the part corresponding to the electrode pad of an electronic part chip 15 and also having conductivity on the surface excluding the recessed part 12, is prepared. Then, said supporting member 11 is charged, microscopic metal particles 14 are retained in the recessed part 12 by electrostatic force, they are transferred to the electrode 15a of an electronic part chip 15, and a bump electrode is formed on the electrode 15a of the semiconductor chip 15 without conducting a plating treatment, the control of which is difficult. As a result, the measurements of the bump electrode, especially uniform height, can be formed easily.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62200776A JP2538605B2 (en) | 1987-08-13 | 1987-08-13 | Electronic component manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62200776A JP2538605B2 (en) | 1987-08-13 | 1987-08-13 | Electronic component manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6445150A true JPS6445150A (en) | 1989-02-17 |
| JP2538605B2 JP2538605B2 (en) | 1996-09-25 |
Family
ID=16429991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62200776A Expired - Fee Related JP2538605B2 (en) | 1987-08-13 | 1987-08-13 | Electronic component manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2538605B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH042139A (en) * | 1990-04-18 | 1992-01-07 | Ibiden Co Ltd | Solder supply plate |
| US6320158B1 (en) | 1998-01-29 | 2001-11-20 | Fujitsu Limited | Method and apparatus of fabricating perforated plate |
| US6432806B1 (en) | 1997-09-08 | 2002-08-13 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| CN117855340A (en) * | 2024-03-07 | 2024-04-09 | 山西创芯光电科技有限公司 | A method for preparing indium column for reducing blind element rate of infrared detector |
-
1987
- 1987-08-13 JP JP62200776A patent/JP2538605B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH042139A (en) * | 1990-04-18 | 1992-01-07 | Ibiden Co Ltd | Solder supply plate |
| US6432806B1 (en) | 1997-09-08 | 2002-08-13 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| US6320158B1 (en) | 1998-01-29 | 2001-11-20 | Fujitsu Limited | Method and apparatus of fabricating perforated plate |
| CN117855340A (en) * | 2024-03-07 | 2024-04-09 | 山西创芯光电科技有限公司 | A method for preparing indium column for reducing blind element rate of infrared detector |
| CN117855340B (en) * | 2024-03-07 | 2024-05-17 | 山西创芯光电科技有限公司 | Indium column preparation method for reducing blind pixel rate of infrared detector |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2538605B2 (en) | 1996-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |