JPS6447038U - - Google Patents
Info
- Publication number
- JPS6447038U JPS6447038U JP1987141454U JP14145487U JPS6447038U JP S6447038 U JPS6447038 U JP S6447038U JP 1987141454 U JP1987141454 U JP 1987141454U JP 14145487 U JP14145487 U JP 14145487U JP S6447038 U JPS6447038 U JP S6447038U
- Authority
- JP
- Japan
- Prior art keywords
- pattern portion
- conductor pattern
- integrated device
- hybrid integrated
- ring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
Landscapes
- Die Bonding (AREA)
Description
第１図は本考案に係る混成集積装置の要部にお
ける平面図、第２図は同じくその正面部分断面図
、第３図は同じく別の実施例における要部の平面
図、第４図は同じくその正面部分断面図、第５図
は従来の混成集積装置の要部の平面図、第６図は
同じくその正面部分断面図、第７図は従来の混成
集積装置の問題点を説明するための要部の平面図
、第８図は同じくその正面部分断面図である。
１……絶縁基板、２……導体パターン部、３…
…ダイ材、４……半導体チツプ、７……リング状
導体パターン。
Fig. 1 is a plan view of the main part of the hybrid accumulation device according to the present invention, Fig. 2 is a front partial sectional view thereof, Fig. 3 is a plan view of the main part of another embodiment, and Fig. 4 is the same. 5 is a plan view of the main parts of the conventional hybrid accumulation device, FIG. 6 is a partial front sectional view of the same, and FIG. 7 is a diagram for explaining the problems of the conventional hybrid accumulation device. A plan view of the main part, and FIG. 8 is also a partial front sectional view thereof. 1... Insulating substrate, 2... Conductor pattern section, 3...
...Die material, 4...Semiconductor chip, 7...Ring-shaped conductor pattern.
Claims (1)
半導体チツプを接着した混成集積装置において、
前記導体パターン部の周囲に、この導体パターン
部を間隔を隔てて囲むリング状導体パターン部を
形成したことを特徴とする混成集積装置。 (2) 前記リング状導体パターン部は、前記導体
パターン部と電気的に接続させたことを特徴とす
る実用新案登録請求の範囲第１項に記載の混成集
積装置。 (3) 前記リング状導体パターン部は、銅箔でな
ることを特徴とする実用新案登録請求の範囲第１
項に記載の混成集積装置。 (4) 前記リング状導体パターン部は、Ｃｕ―Ｎ
ｉ―ＡｕもしくはＡｇ―Ｐｄでなることを特徴と
する実用新案登録請求の範囲第１項または第２項
に記載の混成集積装置。[Scope of claims for utility model registration] (1) In a hybrid integrated device in which a semiconductor chip is bonded to a conductive pattern portion formed on an insulating substrate,
A hybrid integrated device characterized in that a ring-shaped conductor pattern portion is formed around the conductor pattern portion to surround the conductor pattern portion at intervals. (2) The hybrid integrated device according to claim 1, wherein the ring-shaped conductor pattern portion is electrically connected to the conductor pattern portion. (3) Utility model registration claim 1, characterized in that the ring-shaped conductor pattern portion is made of copper foil.
The hybrid integrated device described in Section 1. (4) The ring-shaped conductor pattern portion is made of Cu—N
The hybrid integrated device according to claim 1 or 2, characterized in that it is made of i-Au or Ag-Pd.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987141454U JPS6447038U (en) | 1987-09-16 | 1987-09-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987141454U JPS6447038U (en) | 1987-09-16 | 1987-09-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6447038U true JPS6447038U (en) | 1989-03-23 |
Family
ID=31406527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987141454U Pending JPS6447038U (en) | 1987-09-16 | 1987-09-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6447038U (en) |
-
1987
- 1987-09-16 JP JP1987141454U patent/JPS6447038U/ja active Pending