JPS6447058A - Package for semiconductor device - Google Patents

Package for semiconductor device

Info

Publication number
JPS6447058A
JPS6447058A JP62204799A JP20479987A JPS6447058A JP S6447058 A JPS6447058 A JP S6447058A JP 62204799 A JP62204799 A JP 62204799A JP 20479987 A JP20479987 A JP 20479987A JP S6447058 A JPS6447058 A JP S6447058A
Authority
JP
Japan
Prior art keywords
resin substrate
section
tips
piece
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP62204799A
Other languages
Japanese (ja)
Inventor
Takeshi Sato
Katsuya Fukase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinko Electric Industries Co Ltd
Original Assignee
Shinko Electric Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Industries Co Ltd filed Critical Shinko Electric Industries Co Ltd
Priority to JP62204799A priority Critical patent/JPS6447058A/en
Publication of JPS6447058A publication Critical patent/JPS6447058A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H10W40/778—Auxiliary members characterised by their shape in encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To increase a device of this design in number of pins and also improve it in moisture resistant and heat dissipating properties by a method wherein leads are formed in one piece with a resin substrate through an insert molding in such a manner that tips of them are positioned at the peripheral section of a resin substrate surface and a part of the surface of their chips is at least partially exposed from the resin substrate surface, and an internal circuit pattern section is formed on the surface of the resin substrate which surrounds a semiconductor element mounting section. CONSTITUTION:A resin substrate 30 and a lead frame 32 are formed into one piece by making lead 38 tips of the lead frame 32 be inserted into a mold. In this process, at least a part of the lead 38 tips is so set as to be exposed from the resin substrate 30 to be connected with an internal circuit pattern section 48. A flange section 46 extending outward is provided to a base of a heat sink 44 which is formed through an insert molding so as to bury its base in the resin substrate 30 in one piece, where the flange section 46 prevents moisture from infiltrating through the interface between the heat sink 44 and the resin substrate 30. The internal circuit pattern section 48 is formed in such a manner that a copper foil is adhered onto a heat resistant resin sheet and incorporated in with the lead frame 32, performing a position alignment and a tine pattern is transferred on the surface of the resin substrate 30 which is formed by injecting resin into the mold.
JP62204799A 1987-08-18 1987-08-18 Package for semiconductor device Pending JPS6447058A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62204799A JPS6447058A (en) 1987-08-18 1987-08-18 Package for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62204799A JPS6447058A (en) 1987-08-18 1987-08-18 Package for semiconductor device

Publications (1)

Publication Number Publication Date
JPS6447058A true JPS6447058A (en) 1989-02-21

Family

ID=16496552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62204799A Pending JPS6447058A (en) 1987-08-18 1987-08-18 Package for semiconductor device

Country Status (1)

Country Link
JP (1) JPS6447058A (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251166A (en) * 1989-03-24 1990-10-08 Matsushita Electric Works Ltd Semiconductor package for surface mounting
JPH0389539A (en) * 1989-08-31 1991-04-15 Mitsui High Tec Inc Lead frame and semiconductor device using thereof and manufacture of semiconductor device
US5328870A (en) * 1992-01-17 1994-07-12 Amkor Electronics, Inc. Method for forming plastic molded package with heat sink for integrated circuit devices
US6271583B1 (en) * 1992-06-02 2001-08-07 Fujitsu Limited Semiconductor device having resin encapsulated package structure
US6858930B2 (en) * 2002-10-07 2005-02-22 Lsi Logic Corporation Multi chip module
US7105919B2 (en) * 2003-11-11 2006-09-12 Samsung Electronics Co., Ltd. Semiconductor package having ultra-thin thickness and method of manufacturing the same
JP2009296708A (en) * 2008-06-02 2009-12-17 Honda Motor Co Ltd Power conversion apparatus
CN102543913A (en) * 2010-10-29 2012-07-04 新光电气工业株式会社 Wiring substrate, electronic device, and method of manufacturing wiring substrate
JP2015214137A (en) * 2014-04-22 2015-12-03 株式会社日昌製作所 Metal insert component, method for producing resin molded part using the metal insert component, monitoring method for high frequency induction heating, and heating temperature grasp method

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02251166A (en) * 1989-03-24 1990-10-08 Matsushita Electric Works Ltd Semiconductor package for surface mounting
JPH0389539A (en) * 1989-08-31 1991-04-15 Mitsui High Tec Inc Lead frame and semiconductor device using thereof and manufacture of semiconductor device
US5328870A (en) * 1992-01-17 1994-07-12 Amkor Electronics, Inc. Method for forming plastic molded package with heat sink for integrated circuit devices
US6271583B1 (en) * 1992-06-02 2001-08-07 Fujitsu Limited Semiconductor device having resin encapsulated package structure
US6858930B2 (en) * 2002-10-07 2005-02-22 Lsi Logic Corporation Multi chip module
US7105919B2 (en) * 2003-11-11 2006-09-12 Samsung Electronics Co., Ltd. Semiconductor package having ultra-thin thickness and method of manufacturing the same
JP2009296708A (en) * 2008-06-02 2009-12-17 Honda Motor Co Ltd Power conversion apparatus
CN102543913A (en) * 2010-10-29 2012-07-04 新光电气工业株式会社 Wiring substrate, electronic device, and method of manufacturing wiring substrate
US8436249B2 (en) 2010-10-29 2013-05-07 Shinko Electric Industries Co., Ltd. Wiring substrate, electronic device, and method of manufacturing wiring substrate
JP2015214137A (en) * 2014-04-22 2015-12-03 株式会社日昌製作所 Metal insert component, method for producing resin molded part using the metal insert component, monitoring method for high frequency induction heating, and heating temperature grasp method

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