JPS5772338A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5772338A
JPS5772338A JP55148599A JP14859980A JPS5772338A JP S5772338 A JPS5772338 A JP S5772338A JP 55148599 A JP55148599 A JP 55148599A JP 14859980 A JP14859980 A JP 14859980A JP S5772338 A JPS5772338 A JP S5772338A
Authority
JP
Japan
Prior art keywords
chip
resin
coated
sticking
ceramic package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55148599A
Other languages
Japanese (ja)
Other versions
JPS637459B2 (en
Inventor
Teiichi Endo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55148599A priority Critical patent/JPS5772338A/en
Publication of JPS5772338A publication Critical patent/JPS5772338A/en
Publication of JPS637459B2 publication Critical patent/JPS637459B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/47—Solid or gel fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Die Bonding (AREA)

Abstract

PURPOSE:To avoid a short circuit phenomena caused by a conductive piece by a method wherein the part of the chip-sticking surface of a ceramic package on which a semiconductor chip is not placed is coated with thermal resistant resin after the semiconductor chip is placed. CONSTITUTION:After a chip 2 is bonded to a surface 7 for sticking a chip of a ceramic package 1, the remaining surface is coated with polyimide or thermal resistant silicon resin 8. Through the situation, even if there are small pieces that are easy to be separated on the bottom surface, since they are enclosed in the resin, short circuits of wiring can not be found afterward.
JP55148599A 1980-10-23 1980-10-23 Manufacture of semiconductor device Granted JPS5772338A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55148599A JPS5772338A (en) 1980-10-23 1980-10-23 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55148599A JPS5772338A (en) 1980-10-23 1980-10-23 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5772338A true JPS5772338A (en) 1982-05-06
JPS637459B2 JPS637459B2 (en) 1988-02-17

Family

ID=15456357

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55148599A Granted JPS5772338A (en) 1980-10-23 1980-10-23 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5772338A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4801998A (en) * 1984-08-20 1989-01-31 Oki Electric Industry Co., Ltd. EPROM device

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04223876A (en) * 1990-12-26 1992-08-13 Mitsubishi Materials Corp Grindstone for grinding lens

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4801998A (en) * 1984-08-20 1989-01-31 Oki Electric Industry Co., Ltd. EPROM device

Also Published As

Publication number Publication date
JPS637459B2 (en) 1988-02-17

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